公开(公告)号：US08933474B2

公开(公告)日：2015-01-13

申请号：US13564330

申请日：2012-08-01

Applicant: Cheol Jun Yoo ,  Young Hee Song

Inventor： Cheol Jun Yoo ,  Young Hee Song

IPC: H01L33/00 ,  H01L33/60

CPC classification number: H01L33/60 ,  H01L2224/13 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light emitting diode (LED) package and a manufacturing method thereof are provided. The LED package includes a substrate including a circuit layer, an LED mounted on the substrate, and a plurality of protruded reflection units disposed in a region excluding an LED mounting region on the substrate and configured to reflect light generated from the LED.

Abstract translation: 提供一种发光二极管（LED）封装及其制造方法。 LED封装包括：基板，包括电路层，安装在基板上的LED以及设置在除了基板上的LED安装区域之外的区域中的多个突出反射单元，其被配置为反射从LED产生的光。

公开(公告)号：US08710513B2

公开(公告)日：2014-04-29

申请号：US13365922

申请日：2012-02-03

Applicant: Cheol-jun Yoo ,  Young-hee Song

Inventor： Cheol-jun Yoo ,  Young-hee Song

IPC: H01L33/62

CPC classification number: H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/15151 ,  H01L2924/00014

Abstract: A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.

Abstract translation: 发光器件封装以及制造发光器件封装的方法。 发光器件封装包括布线基板; 安装在所述布线基板的第一区域上的齐纳二极管; 安装在所述第一区域上的发光器件芯片和所述布线基板的第二区域; 以及用于固定所述布线基板的至少一部分的模制构件，其中所述齐纳二极管嵌入所述模制构件中。

公开(公告)号：US08546159B2

公开(公告)日：2013-10-01

申请号：US13217828

申请日：2011-08-25

Applicant: Cheol-jun Yoo ,  Seong-jae Hong

Inventor： Cheol-jun Yoo ,  Seong-jae Hong

IPC: H01L21/00 ,  B05B5/00

CPC classification number: B32B3/10 ,  B32B3/08 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L33/50 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2933/0041 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Phosphor films, methods of forming the phosphor films, and methods of coating a phosphor layer on light-emitting chips are disclosed. The phosphor film includes: a base film; a phosphor layer that is formed on the base film and comprises an incompletely cured resin material and phosphor particles mixed with the incompletely cured resin material; and a cover film that is formed on the phosphor layer and protects the phosphor layer.

Abstract translation: 公开了荧光体膜，形成荧光体膜的方法以及在发光芯片上涂布磷光体层的方法。 荧光体膜包括：基膜; 形成在所述基底膜上的荧光体层，其包含未完全固化的树脂材料和与所述不完全固化的树脂材料混合的荧光体颗粒; 以及形成在荧光体层上并保护荧光体层的覆盖膜。

公开(公告)号：US20130049239A1

公开(公告)日：2013-02-28

申请号：US13599714

申请日：2012-08-30

Applicant: Cheol Jun YOO

Inventor： Cheol Jun YOO

IPC: G02B1/12 ,  B29C45/34

CPC classification number: B29C45/34 ,  B29C45/14336 ,  B29L2011/0016

Abstract: A lens fabrication apparatus includes: a lens mold having a connection portion formed on one side thereof and disposed on a light emission surface of a light emitting unit; and a vacuum forming unit discharging air from within the lens mold to the outside through the connection portion or injecting a material into the lens mold through the connection portion.

Abstract translation: 一种透镜制造装置，包括：透镜模具，其具有形成在其一侧的连接部，并设置在发光单元的发光面上; 以及真空成型单元，其通过连接部将透镜模内的空气排出到外部，或者通过连接部将材料注入到透镜模具中。

公开(公告)号：US20120268916A1

公开(公告)日：2012-10-25

申请号：US13428977

申请日：2012-03-23

Applicant: Cheol Jun Yoo

Inventor： Cheol Jun Yoo

IPC: F21V13/08 ,  H05K3/30 ,  F21V13/12 ,  F21V13/04 ,  F21V7/04 ,  F21V13/10

CPC classification number: H01L33/647 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  Y10T29/4913 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a light emitting device including electrode pads; a body part supporting the light emitting device, including a reflective groove exposing an upper surface of the light emitting device in an upper surface thereof, and exposing a lower surface of the light emitting device through a lower surface thereof; and a lens part provided on the body part and covering the light emitting device.

Abstract translation: 提供了一种发光器件封装及其制造方法。 发光器件封装包括包括电极焊盘的发光器件; 支撑发光器件的主体部分，包括在其上表面中暴露发光器件的上表面的反射槽，并且通过其下表面暴露发光器件的下表面; 以及设置在主体部分上并覆盖发光装置的透镜部分。

公开(公告)号：US20120205699A1

公开(公告)日：2012-08-16

申请号：US13365922

申请日：2012-02-03

Applicant: Cheol-jun YOO ,  Young-hee Song

Inventor： Cheol-jun YOO ,  Young-hee Song

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/50

CPC classification number: H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/15151 ,  H01L2924/00014

Abstract: A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.

Abstract translation: 发光器件封装以及制造发光器件封装的方法。 发光器件封装包括布线基板; 安装在所述布线基板的第一区域上的齐纳二极管; 安装在所述第一区域上的发光器件芯片和所述布线基板的第二区域; 以及用于固定所述布线基板的至少一部分的模制构件，其中所述齐纳二极管嵌入所述模制构件中。

公开(公告)号：US20120161181A1

公开(公告)日：2012-06-28

申请号：US13328864

申请日：2011-12-16

Applicant: Cheol Jun YOO ,  Young Hee Song ,  Seong Deok Hwang ,  Sang Hyun Lee

Inventor： Cheol Jun YOO ,  Young Hee Song ,  Seong Deok Hwang ,  Sang Hyun Lee

IPC: H01L33/58

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.

Abstract translation: 提供了一种发光器件封装，包括：多个引线框架，被布置成彼此分离; 至少一个发光装置，其安装在引线框架上，并通过设置在引线接合焊盘上的接合线电连接到引线框架，所述引线接合焊盘设置在作为上表面设置的发光面的同一表面上 发光装置; 形成为封装并支撑引线接合焊盘，接合线，发光器件和引线框架的主体部分，并且具有形成在其上表面中的反射槽，以将发光表面暴露于外部; 以及设置在主体部分上的透镜部分，以覆盖发光器件。

公开(公告)号：US08952404B2

公开(公告)日：2015-02-10

申请号：US13348369

申请日：2012-01-11

Applicant: Cheol-jun Yoo ,  Young-hee Song

Inventor： Cheol-jun Yoo ,  Young-hee Song

IPC: H01L33/44 ,  H01L33/48 ,  B29C45/14 ,  H01L33/54 ,  H01L33/64

CPC classification number: H01L33/486 ,  B29C45/14344 ,  B29C45/14655 ,  B29C45/14836 ,  H01L33/54 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/15311 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package includes, for example, a wiring substrate having an opening; a light-emitting device that is disposed on the wiring substrate and covers the opening; a bonding wire electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist and a bump formed on the bottom surface of the wiring substrate.

Abstract translation: 具有提高接合线的连接可靠性的发光器件封装，由于后成型而导致的散热特性和光质量以及制造发光器件封装的方法。 发光器件封装包括例如具有开口的布线基板; 发光装置，其布置在所述布线基板上并覆盖所述开口; 通过所述开口将所述布线基板的底面与所述发光装置的底面电连接的接合线; 在布线基板的上表面的一部分上形成有围绕发光装置的侧面而不是作为发光面的发光元件的顶面的成型部件， 布线基板的开口以覆盖接合线; 以及形成在布线基板的底面上的阻焊剂和凸块。

公开(公告)号：US08796050B2

公开(公告)日：2014-08-05

申请号：US13338678

申请日：2011-12-28

Applicant: Cheol-jun Yoo ,  Seong-jae Hong ,  Tsuyoshi Tsutsui ,  Shin-kun Kim

Inventor： Cheol-jun Yoo ,  Seong-jae Hong ,  Tsuyoshi Tsutsui ,  Shin-kun Kim

IPC: H01L33/50 ,  H01L33/00 ,  H01L21/67 ,  H01L21/683

CPC classification number: B05C1/027 ,  H01L21/6715 ,  H01L21/6838 ,  H01L33/0079 ,  H01L33/50 ,  H01L2933/0041

Abstract: Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.

Abstract translation: 制造通过在晶片级在半导体发光元件的发射表面上形成荧光层而发出白光的半导体发光器件的制造方法和装置。 该方法包括：在晶片上形成多个发光器件; 使形成有多个发光装置的晶片变薄; 将薄的晶片设置在载体膜上; 以及在所述晶片上的所述多个发光器件的发射表面上形成荧光体层。

公开(公告)号：US08795817B2

公开(公告)日：2014-08-05

申请号：US13818373

申请日：2011-08-24

Applicant: Chang Hoon Kwak ,  II Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

Inventor： Chang Hoon Kwak ,  II Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

IPC: B32B3/10 ,  B32B5/16 ,  H01L33/50 ,  C09K11/06

CPC classification number: H01L33/50 ,  B32B3/08 ,  B32B3/10 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L24/97 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2933/0041 ,  H05B33/22 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/00012

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Abstract translation: 提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。 荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。