Invention Grant
- Patent Title: Facet-free semiconductor device
- Patent Title (中): 无方块半导体器件
-
Application No.: US12905579Application Date: 2010-10-15
-
Publication No.: US08680625B2Publication Date: 2014-03-25
- Inventor: Wei-Han Fan , Yu-Hsien Lin , Yimin Huang , Ming-Huan Tsai , Hsueh-Chang Sung , Chun-Fai Cheng
- Applicant: Wei-Han Fan , Yu-Hsien Lin , Yimin Huang , Ming-Huan Tsai , Hsueh-Chang Sung , Chun-Fai Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
An exemplary semiconductor device is described, which includes a semiconductor substrate having an active region and an isolation region. The active region has a first edge which interfaces with the isolation region. A gate structure formed on the semiconductor substrate. A spacer element abuts the gate structure and overlies the first edge. In an embodiment, the isolation region is an STI structure. An epitaxy region may be formed adjacent the spacer. In embodiments, this epitaxy region is facet-free.
Public/Granted literature
- US20120091539A1 FACET-FREE SEMICONDUCTOR DEVICE Public/Granted day:2012-04-19
Information query
IPC分类: