发明授权
- 专利标题: Facet-free semiconductor device
- 专利标题(中): 无方块半导体器件
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申请号: US12905579申请日: 2010-10-15
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公开(公告)号: US08680625B2公开(公告)日: 2014-03-25
- 发明人: Wei-Han Fan , Yu-Hsien Lin , Yimin Huang , Ming-Huan Tsai , Hsueh-Chang Sung , Chun-Fai Cheng
- 申请人: Wei-Han Fan , Yu-Hsien Lin , Yimin Huang , Ming-Huan Tsai , Hsueh-Chang Sung , Chun-Fai Cheng
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: H01L27/088
- IPC分类号: H01L27/088
摘要:
An exemplary semiconductor device is described, which includes a semiconductor substrate having an active region and an isolation region. The active region has a first edge which interfaces with the isolation region. A gate structure formed on the semiconductor substrate. A spacer element abuts the gate structure and overlies the first edge. In an embodiment, the isolation region is an STI structure. An epitaxy region may be formed adjacent the spacer. In embodiments, this epitaxy region is facet-free.
公开/授权文献
- US20120091539A1 FACET-FREE SEMICONDUCTOR DEVICE 公开/授权日:2012-04-19
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