Invention Grant
- Patent Title: Corrosion-resistant member for semiconductor manufacturing apparatus and method for manufacturing the same
- Patent Title (中): 用于半导体制造装置的耐腐蚀构件及其制造方法
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Application No.: US13624119Application Date: 2012-09-21
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Publication No.: US08685313B2Publication Date: 2014-04-01
- Inventor: Morimichi Watanabe , Yuji Katsuda , Toru Hayase
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2010-079250 20100330
- Main IPC: C04B35/00
- IPC: C04B35/00

Abstract:
A mixed powder was prepared by weighing Yb2O3 and SrCO3 in such a way that the molar ratio became 1:1. The resulting mixed powder was subjected to uniaxial pressure forming, so as to produce a disc-shaped compact. The compact was heat-treated in an air atmosphere, so that a complex oxide was synthesized. The resulting complex oxide was pulverized. After the pulverization, a slurry was taken out and was dried in a nitrogen gas stream, so as to produce a synthesized powder material. The resulting synthesized powder material was subjected to uniaxial pressure forming, so as to produce a disc-shaped compact. The resulting compact was fired by a hot-press method, so as to obtain a corrosion-resistant member for semiconductor manufacturing apparatus. The resulting corrosion-resistant member was made from a SrYb2O4.
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