Invention Grant
US08686313B2 System and methods for forming apertures in microfeature workpieces
有权
用于在微型工件中形成孔的系统和方法
- Patent Title: System and methods for forming apertures in microfeature workpieces
- Patent Title (中): 用于在微型工件中形成孔的系统和方法
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Application No.: US14029105Application Date: 2013-09-17
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Publication No.: US08686313B2Publication Date: 2014-04-01
- Inventor: Charles M. Watkins , William M. Hiatt
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B23K26/36

Abstract:
Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.
Public/Granted literature
- US20140014635A1 SYSTEM AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES Public/Granted day:2014-01-16
Information query
IPC分类: