Invention Grant
- Patent Title: Micromechanical system
- Patent Title (中): 微机械系统
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Application No.: US12806311Application Date: 2010-08-09
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Publication No.: US08689633B2Publication Date: 2014-04-08
- Inventor: Johannes Classen
- Applicant: Johannes Classen
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102009029202 20090904
- Main IPC: G01P15/125
- IPC: G01P15/125

Abstract:
A micromechanical system includes a first movable element, which is connected to a substrate via a first spring element, and a second movable element, which is connected to the substrate via a second spring element. The first movable element and the second movable element are movable in relation to the substrate independent of one another. Furthermore, the first movable element and the second movable element are situated one above the other in at least some sections in a direction perpendicular to the substrate surface.
Public/Granted literature
- US20110056295A1 Micromechanical system Public/Granted day:2011-03-10
Information query
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