Invention Grant
- Patent Title: Substrate heating device and substrate heating method
- Patent Title (中): 基板加热装置和基板加热方法
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Application No.: US13770108Application Date: 2013-02-19
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Publication No.: US08692166B2Publication Date: 2014-04-08
- Inventor: Takehiko Yokomori
- Applicant: Ushio Denki Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Ushio Denki Kabushiki Kaisha
- Current Assignee: Ushio Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent David S. Safran
- Priority: JP2007-339823 20071228
- Main IPC: B23K11/00
- IPC: B23K11/00 ; C23C16/00 ; B05C11/00 ; C23F1/00 ; H01L21/306 ; H01J7/44 ; H01J7/24 ; H05B39/00 ; H05B41/14
Abstract:
A device for heating a substrate with light from a flash lamp having a semiconductor switch connected in series to the flash lamp. After triggering of a trigger electrode of the flash lamp, a first drive signal and a second drive signal are output from a gate circuit. The time period when the semiconductor switch is on due to the second drive signal is longer than the time period that the semiconductor switch is on by the first drive signal. Then, the semiconductor switch is switched on and off by the first drive signal and the substrate temperature is increased to a temperature, which is lower than the desired temperature to be targeted, and is maintained a that temperature for a short time, after which the surface temperature of the substrate is increased to the desired target temperature.
Public/Granted literature
- US20130156409A1 SUBSTRATE HEATING DEVICE AND SUBSTRATE HEATING METHOD Public/Granted day:2013-06-20
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