Invention Grant
- Patent Title: MEMS acoustic sensor with integrated back cavity
- Patent Title (中): 具有集成后腔的MEMS声学传感器
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Application No.: US13800061Application Date: 2013-03-13
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Publication No.: US08692340B1Publication Date: 2014-04-08
- Inventor: Erhan Polatkan Ata , Martin Lim , Xiang Li , Stephen Lloyd , Michael Julian Daneman
- Applicant: InvenSense, Inc.
- Applicant Address: US CA San Jose
- Assignee: Invensense, Inc.
- Current Assignee: Invensense, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Sawyer Law Group, P.C.
- Main IPC: H01L29/82
- IPC: H01L29/82

Abstract:
A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.
Information query
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