发明授权
US08694144B2 Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
失效
在化学机械抛光中在同一台板上对不同厚度的多个基板进行端点控制
- 专利标题： Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
- 专利标题（中）： 在化学机械抛光中在同一台板上对不同厚度的多个基板进行端点控制
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申请号： US12871714申请日： 2010-08-30
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公开(公告)号： US08694144B2公开(公告)日： 2014-04-08
- 发明人: Alain Duboust , Stephen Jew , David H. Mai , Huyen Tran , Wen-Chiang Tu , Shih-Haur Shen , Jimin Zhang , Ingemar Carlsson , Boguslaw A. Swedek , Zhihong Wang
- 申请人： Alain Duboust , Stephen Jew , David H. Mai , Huyen Tran , Wen-Chiang Tu , Shih-Haur Shen , Jimin Zhang , Ingemar Carlsson , Boguslaw A. Swedek , Zhihong Wang
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Fish & Richardson P.C.
- 主分类号： G06F19/00
- IPC分类号： G06F19/00
摘要：
A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first pre-polish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.
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