公开(公告)号：US4078146A

公开(公告)日：1978-03-07

申请号：US744858

申请日：1976-11-24

Applicant: Peder Bernhard Berntsson ,  Arne Elof Brandstrom ,  Enar Ingemar Carlsson ,  Stig Ake Ingemar Carlsson ,  Lars Ek ,  Benny Roger Samuelsson ,  Sven Erik Sjostrand ,  Gert Christer Strandlund ,  Bengt Arne Hjalmar Ablad

Inventor： Peder Bernhard Berntsson ,  Arne Elof Brandstrom ,  Enar Ingemar Carlsson ,  Stig Ake Ingemar Carlsson ,  Lars Ek ,  Benny Roger Samuelsson ,  Sven Erik Sjostrand ,  Gert Christer Strandlund ,  Bengt Arne Hjalmar Ablad

IPC: C07C275/24 ,  C07C125/06

CPC classification number: C07C275/24

Abstract: New amines of the formula ##STR1## wherein the radicals R.sup.1, R.sup.2 and R.sup.3 may be any of a variety of groups described below, several methods for preparing them and the use thereof in the treatment of cardiovascular diseases, particularly in blocking cardial and vascular beta-receptors.

Abstract translation: 具有式“IMAGE”的新的胺，其中基团R 1，R 2和R 3可以是以下描述的各种基团中的任何一种，其制备方法以及其在治疗心血管疾病中的用途，特别是在阻断心脏和血管β 接受者

公开(公告)号：US3996382A

公开(公告)日：1976-12-07

申请号：US347625

申请日：1973-04-04

Applicant: Peder Bernhard Berntsson ,  Arne Elof Brandstrom ,  Enar Ingemar Carlsson ,  Stig Ake Ingemar Carlsson ,  Lars Ek ,  Benny Roger Samuelsson ,  Sven Erik Sjastrand ,  Gert Christer Strandlund ,  Bengt Arne Hjalmar Ablad

Inventor： Peder Bernhard Berntsson ,  Arne Elof Brandstrom ,  Enar Ingemar Carlsson ,  Stig Ake Ingemar Carlsson ,  Lars Ek ,  Benny Roger Samuelsson ,  Sven Erik Sjastrand ,  Gert Christer Strandlund ,  Bengt Arne Hjalmar Ablad

IPC: C07D303/22 ,  A61K20060101 ,  A61K31/13 ,  A61K31/135 ,  A61K31/138 ,  A61K31/325 ,  A61P25/02 ,  C07C20060101 ,  C07C67/00 ,  C07C213/00 ,  C07C217/32 ,  C07C217/34 ,  C07C239/00 ,  C07C271/12 ,  C07C271/16 ,  C07C313/00 ,  C07C323/07 ,  C07C323/12 ,  C07C323/16 ,  C07C323/20 ,  C07C93/06

Abstract: Ortho-para-substituted phenoxy-hydroxypropylamines having the general formula ##STR1## and pharmaceutically acceptable, non-toxic acid addition salts thereof, wherein R.sup.1 is alkyl or hydroxy alkyl, R.sup.2 is alkoxyalkyl, alkylthioalkyl, alkoxycarbonylaminoalkyl, or alkoxyalkoxy, and R.sup.3 is halogen, alkyl, alkenyl, alkinyl, alkoxymethyl, or alkoxy are disclosed as are methods for their preparations;Pharmaceutical preparations are prepared whose active ingredients include at least one of the newly discovered phenoxy-hydroxypropylamine compounds. Therapeutically effective doses of these preparations selectively block the .beta.-receptors of the heart making them useful in treating heart diseases in animals including humans.

Abstract translation: 具有通式为“IMAGE”的正构对位取代的苯氧基 - 羟丙基胺及其药学上可接受的无毒的酸加成盐，其中R1是烷基或羟基烷基，R2是烷氧基烷基，烷硫基烷基，烷氧基羰基氨基烷基或烷氧基烷氧基，R3是卤素 烷基，烯基，炔基，烷氧基甲基或烷氧基作为其制备方法公开; 制备药物制剂，其活性成分包括至少一种新发现的苯氧基 - 羟丙基胺化合物。 这些制剂的治疗有效剂量选择性地阻断心脏的β-受体，使得它们可用于治疗包括人在内的动物的心脏病。

公开(公告)号：US4035420A

公开(公告)日：1977-07-12

申请号：US618754

申请日：1975-10-02

Applicant: Peder Bernhard Berntsson ,  Arne Elof Brandstrom ,  Enar Ingemar Carlsson ,  Stig Ake Ingemar Carlsson ,  Lars Ek ,  Gustav Benny Roger Samuelsson ,  Sven Erik Sjostrand ,  Gert Christer Strandlund ,  Bengt Arne Hjalmar Ablad

Inventor： Peder Bernhard Berntsson ,  Arne Elof Brandstrom ,  Enar Ingemar Carlsson ,  Stig Ake Ingemar Carlsson ,  Lars Ek ,  Gustav Benny Roger Samuelsson ,  Sven Erik Sjostrand ,  Gert Christer Strandlund ,  Bengt Arne Hjalmar Ablad

IPC: C07C275/24 ,  C07C127/17 ,  A61K31/17

CPC classification number: C07C275/24

Abstract: New amines of the formula ##STR1## wherein the radicals R.sup.1, R.sup.2 and R.sup.3 may be any of a variety of groups described below, several methods for preparing them and the use thereof in the treatment of cardiovascular diseases, particularly in blocking cardial and vascular beta-receptors.

Abstract translation: 具有式“IMAGE”的新的胺，其中基团R 1，R 2和R 3可以是以下描述的各种基团中的任何一种，其制备方法以及其在治疗心血管疾病中的用途，特别是在阻断心脏和血管β 接受者

公开(公告)号：US08694144B2

公开(公告)日：2014-04-08

申请号：US12871714

申请日：2010-08-30

Applicant: Alain Duboust ,  Stephen Jew ,  David H. Mai ,  Huyen Tran ,  Wen-Chiang Tu ,  Shih-Haur Shen ,  Jimin Zhang ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Zhihong Wang

Inventor： Alain Duboust ,  Stephen Jew ,  David H. Mai ,  Huyen Tran ,  Wen-Chiang Tu ,  Shih-Haur Shen ,  Jimin Zhang ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Zhihong Wang

IPC: G06F19/00

CPC classification number: B24B37/013 ,  B24B37/042 ,  B65B1/366 ,  G06F17/5086 ,  H01L21/30625 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first pre-polish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.

Abstract translation: 第一衬底的第一预期所需抛光时间与第二衬底的第二预期所需抛光时间之间的差异使用在线计量站测量的第一预抛光厚度和第二预抛光厚度来确定。 基于第一预期所需抛光时间和第二预期所需抛光时间之间的差来确定初始周期的持续时间。 在抛光操作开始时的初始阶段，对于第一基板和第二基板中的任一个具有较少预期的所需抛光时间，而对第一基板和第二基板中的哪一个施加压力同时施加压力 更大的预期需要的抛光时间。 在初始周期之后，对第一基板和第二基板施加压力。

公开(公告)号：US20130224890A1

公开(公告)日：2013-08-29

申请号：US13774843

申请日：2013-02-22

Applicant: Kun Xu ,  Ingemar Carlsson ,  Tzu-Yu Liu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

Inventor： Kun Xu ,  Ingemar Carlsson ,  Tzu-Yu Liu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

IPC: H01L21/66

CPC classification number: H01L22/26 ,  B24B37/005 ,  B24B37/04 ,  B24B49/12 ,  H01L22/12

Abstract: A method of controlling polishing includes storing a desired ratio representing a ratio for a clearance time of a first zone of a substrate to a clearance time of a second zone of the substrate. During polishing of a first substrate, an overlying layer is monitored, a sequence of measurements is generated, and the measurements are sorted a first group associated with the first zone of the substrate and a second group associated with the second zone on the substrate. A first time and a second time at which the overlying layer is cleared is determined based on the measurements from the first group and the second group, respectively. At least one adjusted polishing pressure is calculated for the first zone based on a first pressure applied in the first zone during polishing the first substrate, the first time, the second time, and the desired ratio.

Abstract translation: 控制抛光的方法包括将表示基材的第一区域的间隙时间的比率与基材的第二区域的间隙时间的所需比率进行存储。 在第一衬底的抛光期间，监测上覆层，产生一系列测量，并且对与衬底的第一区域相关联的第一组和与衬底上的第二区域相关联的第二组对第一组进行测量。 基于来自第一组和第二组的测量，分别确定覆盖层被清除的第一次和第二次。 基于在抛光第一基板期间第一区域中施加的第一压力，第一时间，第二时间和期望比率，针对第一区域计算至少一个调整的抛光压力。

公开(公告)号：US20120276662A1

公开(公告)日：2012-11-01

申请号：US13095819

申请日：2011-04-27

Applicant: Hassan G. Iravani ,  Kun Xu ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Shih-Haur Shen ,  Wen-Chiang Tu ,  David Maxwell Gage

Inventor： Hassan G. Iravani ,  Kun Xu ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Shih-Haur Shen ,  Wen-Chiang Tu ,  David Maxwell Gage

IPC: H01L21/66

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  H01L22/14 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of chemical mechanical polishing a substrate includes polishing a plurality of discrete separated metal features of a layer on the substrate at a polishing station, using an eddy current monitoring system to monitor thickness of the metal features in the layer, and controlling pressures applied by a carrier head to the substrate during polishing of the layer at the polishing station based on thickness measurements of the metal features from the eddy current monitoring system to reduce differences between an expected thickness profile of the metal feature and a target profile.

Abstract translation: 用于化学机械研磨衬底的方法包括在抛光工位上使用涡流监测系统来研磨衬底上的层的多个离散分离的金属特征，以监测该层中的金属特征的厚度，以及控制由 基于来自涡流监视系统的金属特征的厚度测量，在抛光台处抛光层期间的载体头到达基板，以减少金属特征的预期厚度分布与目标轮廓之间的差异。

公开(公告)号：US08295967B2

公开(公告)日：2012-10-23

申请号：US12267434

申请日：2008-11-07

Applicant: Jimin Zhang ,  Thomas H. Osterheld ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Stephen Jew

Inventor： Jimin Zhang ,  Thomas H. Osterheld ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Stephen Jew

IPC: G06F19/00

CPC classification number: B24B37/013 ,  B24B49/12

Abstract: A computer-implemented method includes polishing substrates simultaneously in a polishing apparatus. Each substrate has a polishing rate independently controllable by an independently variable polishing parameter. Measurement data that varies with the thickness of each of the substrates is acquired from each of the substrates during polishing with an in-situ monitoring system. A projected thickness that each substrate will have at a target time is determined based on the measurement data. The polishing parameter for at least one substrate is adjusted to adjust the polishing rate of the at least one substrate such that the substrates have closer to the same thickness at the target time than without the adjustment.

Abstract translation: 计算机实现的方法包括在抛光装置中同时抛光衬底。 每个基底具有通过独立可变抛光参数独立控制的抛光速率。 随着每个基板的厚度变化的测量数据在用原位监测系统进行抛光时从每个基板获得。 基于测量数据确定每个基板在目标时间具有的投影厚度。 调整至少一个基板的抛光参数以调节至少一个基板的抛光速率，使得基板在目标时间比不进行调节更接近相同的厚度。

公开(公告)号：US20110294400A1

公开(公告)日：2011-12-01

申请号：US13193011

申请日：2011-07-28

Applicant: Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

Inventor： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

IPC: B24B51/00

CPC classification number: G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

Abstract translation: 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

公开(公告)号：US07746485B2

公开(公告)日：2010-06-29

申请号：US12253160

申请日：2008-10-16

Applicant: Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

Inventor： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

IPC: G01B11/28

CPC classification number: G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

Abstract translation: 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

公开(公告)号：US20100124792A1

公开(公告)日：2010-05-20

申请号：US12616761

申请日：2009-11-11

Applicant: Hassan G. Iravani ,  Ingemar Carlsson ,  Boguslaw A. Swedek

Inventor： Hassan G. Iravani ,  Ingemar Carlsson ,  Boguslaw A. Swedek

IPC: H01L21/66 ,  H01L21/304

CPC classification number: B24B37/013 ,  B24B49/105 ,  H01L22/12 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus for monitoring the thickness of a conductive layer on a substrate includes a support to hold a substrate having a conductive layer, an eddy current monitoring system including a first plurality of core portions, and a motor to cause relative motion between the support and the eddy current monitoring system such that the substrate moves across the first plurality of core portions in a direction that defines a first axis. At least one core portion is positioned further from a second axis than at least two other core portions. The second axis is orthogonal to the first axis.

Abstract translation: 用于监测基板上的导电层的厚度的装置包括：用于保持具有导电层的基板的支撑体，包括第一多个芯部的涡流监视系统，以及引起支撑件与支撑件之间的相对运动的马达 涡流监视系统，使得基板沿着限定第一轴线的方向跨越第一多个芯部分移动。 至少一个芯部比第二轴更靠近至少两个其它芯部。 第二轴与第一轴正交。