Invention Grant
US08697457B1 Devices and methods for stacking individually tested devices to form multi-chip electronic modules
有权
用于堆叠单独测试的设备以形成多芯片电子模块的设备和方法
- Patent Title: Devices and methods for stacking individually tested devices to form multi-chip electronic modules
- Patent Title (中): 用于堆叠单独测试的设备以形成多芯片电子模块的设备和方法
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Application No.: US13529267Application Date: 2012-06-21
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Publication No.: US08697457B1Publication Date: 2014-04-15
- Inventor: Keith K. Sturcken , John A. Hughes , Thomas E. Love , Sheila J. Konecke , Jeffrey Montag , Peter M. Wallace
- Applicant: Keith K. Sturcken , John A. Hughes , Thomas E. Love , Sheila J. Konecke , Jeffrey Montag , Peter M. Wallace
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agent Daniel J. Long
- Main IPC: G01R31/26
- IPC: G01R31/26
Abstract:
A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.
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