Invention Grant
US08697494B2 Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method
有权
制造倒装芯片封装的方法和用于附接在该方法中使用的半导体芯片的装置
- Patent Title: Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method
- Patent Title (中): 制造倒装芯片封装的方法和用于附接在该方法中使用的半导体芯片的装置
-
Application No.: US13241517Application Date: 2011-09-23
-
Publication No.: US08697494B2Publication Date: 2014-04-15
- Inventor: Chang-Seong Jeon , Ho-Geon Song , Mitsuo Umemoto , Sang-Sick Park
- Applicant: Chang-Seong Jeon , Ho-Geon Song , Mitsuo Umemoto , Sang-Sick Park
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2010-0102984 20101021
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.
Public/Granted literature
Information query
IPC分类:
