发明授权
- 专利标题： Chip resistor and method of manufacturing the same
- 专利标题（中）： 贴片电阻及其制造方法
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申请号： US13441596申请日： 2012-04-06
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公开(公告)号： US08698593B2公开(公告)日： 2014-04-15
- 发明人: Jang Ho Park , Young Key Kim , Ki Won Suh , Jang Seok Yun , Jin Man Han , Sung Jun Kim
- 申请人： Jang Ho Park , Young Key Kim , Ki Won Suh , Jang Seok Yun , Jin Man Han , Sung Jun Kim
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2011-0137250 20111219
- 主分类号： H01C1/012
- IPC分类号： H01C1/012
摘要：
There is provided a chip resistor including a ceramic substrate; a first resistance layer formed on the ceramic substrate and including a first conductive metal and a first glass; and a second resistance layer formed on the first resistance layer, including a second conductive metal and a second glass, and having a smaller content of glass than the first resistance layer, thereby obtaining relatively low resistance and a relatively small temperature coefficient of resistance (TCR).
公开/授权文献
- US20130154790A1 CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME 公开/授权日：2013-06-20
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