发明授权
- 专利标题： Substrate treatment method, coating treatment apparatus, and substrate treatment system
- 专利标题（中）： 基板处理方法，涂布处理装置和基板处理系统
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申请号： US13041935申请日： 2011-03-07
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公开(公告)号： US08703400B2公开(公告)日： 2014-04-22
- 发明人: Kenji Tsutsumi , Junichi Kitano , Osamu Miyahara , Hideharu Kyouda
- 申请人： Kenji Tsutsumi , Junichi Kitano , Osamu Miyahara , Hideharu Kyouda
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2007-011243 20070122
- 主分类号： G03F7/26
- IPC分类号： G03F7/26
摘要：
In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.