Invention Grant
- Patent Title: Light emitting module
- Patent Title (中): 发光模块
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Application No.: US13724991Application Date: 2012-12-21
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Publication No.: US08704261B2Publication Date: 2014-04-22
- Inventor: Takaaki Komatsu , Yasuaki Tsutsumi , Hisayoshi Daicho
- Applicant: Koito Manufacturing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Koito Manufacturing Co., Ltd.
- Current Assignee: Koito Manufacturing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll Rooney PC
- Priority: JP2010-167398 20100726; WOPCT/JP2011/003155 20110603
- Main IPC: H01L33/50
- IPC: H01L33/50

Abstract:
A light emitting module includes: an LED chip; a plate-shaped phosphor layer that is provided so as to face the light emitting surface of the LED chip and is configured to convert the wavelength of the light emitted by the LED chip; and a filter layer that is formed, of the surfaces of the phosphor layer, on at least one of the surface that faces the LED chip and the side surface, and that is configured to transmit the light emitted from the LED chip and to reflect the light whose wavelength has been converted by the phosphor layer. The filter layer is formed such that a ratio of the energy of the emitted light within a range of ±60° with respect to the front direction to the total energy of emitted light is 80% or more.
Public/Granted literature
- US20130105850A1 LIGHT EMITTING MODULE Public/Granted day:2013-05-02
Information query
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