发明授权
- 专利标题： Coil-type electronic component and its manufacturing method
- 专利标题（中）： 线圈型电子元件及其制造方法
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申请号： US13348926申请日： 2012-01-12
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公开(公告)号： US08704629B2公开(公告)日： 2014-04-22
- 发明人: Hideki Ogawa , Atsushi Tanada , Hitoshi Matsuura , Kiyoshi Tanaka , Hiroshi Kishi , Kenji Kawano
- 申请人： Hideki Ogawa , Atsushi Tanada , Hitoshi Matsuura , Kiyoshi Tanaka , Hiroshi Kishi , Kenji Kawano
- 申请人地址： JP Tokyo
- 专利权人： Taiyo Yuden Co., Ltd.
- 当前专利权人： Taiyo Yuden Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Law Office of Katsuhiro Arai
- 优先权： JP2010-105552 20100430; JP2011-091879 20110418
- 主分类号： H01F27/24
- IPC分类号： H01F27/24 ; H01F27/02 ; H01F5/00 ; H01F17/04 ; H01F7/06
摘要：
A coil-type electronic component has a coil inside or on the surface of its base material and is characterized in that: the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer.
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