发明授权
- 专利标题： Connecting terminal structure, socket and electronic package
- 专利标题（中）： 连接端子结构，插座和电子封装
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申请号： US13433841申请日： 2012-03-29
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公开(公告)号： US08708711B2公开(公告)日： 2014-04-29
- 发明人: Yasuyoshi Horikawa
- 申请人： Yasuyoshi Horikawa
- 申请人地址： JP Nagano
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano
- 代理机构： IPUSA, PLLC
- 优先权： JP2011-087156 20110411
- 主分类号： H01R12/00
- IPC分类号： H01R12/00
摘要：
A connecting terminal structure includes a supporting body; a plurality of first electrode pads provided on a first side of the supporting body; a plurality of second electrode pads provided on a second side of the supporting body; a flexible substrate configured to electrically connect the first electrode pads to the second electrode pads; and a plurality of connecting terminals joined to at least one of the first electrode pads and the second electrode pads.