Invention Grant
US08710657B2 Semiconductor assembly and semiconductor package including a solder channel
有权
包括焊料通道的半导体组件和半导体封装
- Patent Title: Semiconductor assembly and semiconductor package including a solder channel
- Patent Title (中): 包括焊料通道的半导体组件和半导体封装
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Application No.: US13242864Application Date: 2011-09-23
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Publication No.: US08710657B2Publication Date: 2014-04-29
- Inventor: Jeong-woo Park , Moon-gi Cho , Ui-hyoung Lee , Sun-hee Park
- Applicant: Jeong-woo Park , Moon-gi Cho , Ui-hyoung Lee , Sun-hee Park
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2010-0097418 20101006
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
Semiconductor packages connecting a semiconductor chip to an external device by bumps are provided. The semiconductor packages may include a connection pad on a semiconductor chip, a connecting bump on and configured to be electrically connected to the connection pad and a supporting bump on the semiconductor chip and configured to be electrically isolated from the connection pad. The connection bump may include a first pillar and a first solder ball and the supporting bump may include a second pillar and a second solder ball. The semiconductor packages may further include a solder channel in the second pillar configured to allow a portion of the second solder ball to extend into the solder channel along a predetermined direction.
Public/Granted literature
- US20120086123A1 SEMICONDUCTOR ASSEMBLY AND SEMICONDUCTOR PACKAGE INCLUDING A SOLDER CHANNEL Public/Granted day:2012-04-12
Information query
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