发明授权
- 专利标题: Methods of manufacturing a semiconductor device
- 专利标题(中): 制造半导体器件的方法
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申请号: US13428900申请日: 2012-03-23
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公开(公告)号: US08716093B2公开(公告)日: 2014-05-06
- 发明人: Jin-Bum Kim , Kwan-Heum Lee , Seung-Hun Lee , Byeong-Chan Lee , Sun-Ghil Lee
- 申请人: Jin-Bum Kim , Kwan-Heum Lee , Seung-Hun Lee , Byeong-Chan Lee , Sun-Ghil Lee
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel Sibley & Sajovec, P.A.
- 优先权: KR2008-64069 20080702
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L21/338 ; H01L21/3205 ; H01L21/4763
摘要:
A semiconductor device can include a first gate electrode including a gate insulating pattern, a gate conductive pattern and a capping pattern that are sequentially stacked on a semiconductor substrate, and a first spacer of a low dielectric constant disposed on a lower sidewall of the first gate electrode. A second spacer of a high dielectric constant, that is greater than the low dielectric constant, is disposed on an upper sidewall of the first gate electrode above the first spacer.
公开/授权文献
- US20120184079A1 METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE 公开/授权日:2012-07-19
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