发明授权
US08716093B2 Methods of manufacturing a semiconductor device 有权
制造半导体器件的方法

Methods of manufacturing a semiconductor device
摘要:
A semiconductor device can include a first gate electrode including a gate insulating pattern, a gate conductive pattern and a capping pattern that are sequentially stacked on a semiconductor substrate, and a first spacer of a low dielectric constant disposed on a lower sidewall of the first gate electrode. A second spacer of a high dielectric constant, that is greater than the low dielectric constant, is disposed on an upper sidewall of the first gate electrode above the first spacer.
公开/授权文献
信息查询
0/0