发明授权
- 专利标题: Semiconductor device and method for manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US13553759申请日: 2012-07-19
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公开(公告)号: US08716755B2公开(公告)日: 2014-05-06
- 发明人: Takashi Inoue , Tatsuo Nakayama , Yasuhiro Okamoto , Hironobu Miyamoto
- 申请人: Takashi Inoue , Tatsuo Nakayama , Yasuhiro Okamoto , Hironobu Miyamoto
- 申请人地址: JP Kawasaki-shi, Kanagawa
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Kawasaki-shi, Kanagawa
- 代理机构: McGinn IP Law Group, PLLC
- 优先权: JP2011-202739 20110916
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
Compression strains are generated at an interface between the cap layer and the barrier layer and an interface between the channel layer and the buffer layer and a tensile strain is generated at an interface between the barrier layer and the channel layer. Therefore, negative charge is higher than positive charge at the interface between the cap layer and the barrier layer and the interface between the channel layer and the buffer layer, while positive charge is higher than negative charge at the interface between the barrier layer and the channel. The channel layer has a stacked layer structure of a first layer, a second layer, and a third layer. The second layer has a higher electron affinity than those of the first layer and the third layer.
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