Inter-chip connectivity may be provided in a computing device, which may comprise a USB host and at and at least one USB device embedded within the computing device, based on Universal Serial Bus version 3.0 (USB3.0) interface. In this regard, internal communication of data between the USB host and embedded USB device may be performed via USB3.0 SuperSpeed signals. The USB host and/or the USB3.0 interface may be configured to enable USB3.0 internal communication of data, and to reduce power consumption during the internal communication of data compared to external USB3.0 communications. Configuration of the USB3.0 interface for internal communication of data may comprises modifying and/or adjusting physical (PHY) layer, link layer, and/or protocol layer related parameters, functions, resources, and/or operations. The USB3.0 SuperSpeed signals may be communication using scalable low voltage signaling (SLVS). In this regard, Input/Output (IO) Swing may be set based on loopback training sequence.