Invention Grant
- Patent Title: Semiconductor device and fabricating method thereof
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13670951Application Date: 2012-11-07
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Publication No.: US08723256B1Publication Date: 2014-05-13
- Inventor: Wen-Cheng Lin , Shang-Hui Tu , Shin-Cheng Lin
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device is provided. The device includes a semiconductor substrate and a gate structure thereon. A well region is formed in the semiconductor substrate. A drain region and a source region are respectively formed in the semiconductor substrate inside and outside of the well region. At least one set of the first and second heavily doped regions is formed in the well region between the drain region and the source region, wherein the first and second heavily doped regions are stacked vertically from bottom to top and have a doping concentration which is larger than that of the well region. The semiconductor substrate and the first heavily doped region have a first conductivity type and the well region and the second heavily doped region have a second conductivity type. A method for fabricating a semiconductor device is also disclosed.
Public/Granted literature
- US20140124858A1 SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF Public/Granted day:2014-05-08
Information query
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