Invention Grant
US08729192B2 Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material
有权
环氧树脂组合物，其固化物，新型环氧树脂，新型酚醛树脂和半导体封装材料
- Patent Title: Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material
- Patent Title (中): 环氧树脂组合物，其固化物，新型环氧树脂，新型酚醛树脂和半导体封装材料
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Application No.: US12280934Application Date: 2006-11-10
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Publication No.: US08729192B2Publication Date: 2014-05-20
- Inventor: Kazuo Arita , Ichirou Ogura , Kunihiro Morinaga
- Applicant: Kazuo Arita , Ichirou Ogura , Kunihiro Morinaga
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JPP2006-052537 20060228
- International Application: PCT/JP2006/322474 WO 20061110
- International Announcement: WO2007/099674 WO 20070907
- Main IPC: C08G65/48
- IPC: C08G65/48 ; C08L63/00 ; C08F283/00 ; C08G59/14 ; C08G65/38
Abstract:
The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).
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