Invention Grant
- Patent Title: Substrate inspection
- Patent Title (中): 基板检查
-
Application No.: US13472421Application Date: 2012-05-15
-
Publication No.: US08736831B2Publication Date: 2014-05-27
- Inventor: Mahendra Prabhu Ramachandran , Steven W. Meeks , Romain Sappey
- Applicant: Mahendra Prabhu Ramachandran , Steven W. Meeks , Romain Sappey
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corp.
- Current Assignee: KLA-Tencor Corp.
- Current Assignee Address: US CA Milpitas
- Agent Ann Marie Mewherter
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/95 ; G01N21/956
Abstract:
Various embodiments for substrate inspection are provided.
Public/Granted literature
- US20130308124A1 Substrate Inspection Public/Granted day:2013-11-21
Information query
