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公开(公告)号：US5999310A
公开(公告)日：1999-12-07
申请号：US908247
申请日：1997-08-07
IPC分类号： G01N21/33 , G02B13/14 , G02B15/14 , G02B15/15 , G02B15/16 , G02B17/08 , G02B21/02 , G02B21/16 , G03C5/16 , G03F1/84 , G03F3/00 , G03F7/20 , H04N5/225 , G02B23/06 , G02B13/04
CPC分类号： G03F7/70616 , G02B17/0808 , G02B17/0856 , G02B17/0892 , G02B21/16 , G03F1/84 , G03F7/70225 , G03F7/70275 , G03F7/7065
摘要： An ultra-broadband ultraviolet (UV) catadioptric imaging microscope system with wide-range zoom capability. The microscope system, which comprises a catadioptric lens group and a zooming tube lens group, has high optical resolution in the deep UV wavelengths, continuously adjustable magnification, and a high numerical aperture. The system integrates microscope modules such as objectives, tube lenses and zoom optics to reduce the number of components, and to simplify the system manufacturing process. The preferred embodiment offers excellent image quality across a very broad deep ultraviolet spectral range, combined with an all-refractive zooming tube lens. The zooming tube lens is modified to compensate for higher-order chromatic aberrations that would normally limit performance.
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公开(公告)号：US10733744B2
公开(公告)日：2020-08-04
申请号：US15927011
申请日：2018-03-20
发明人： Thanh Huy Ha , Scott A. Young , Mohan Mahadevan
摘要： Methods and systems for aligning images for a specimen acquired with different modalities are provided. One method includes acquiring information for a specimen that includes at least first and second images for the specimen. The first image is acquired with a first modality different than a second modality used to acquire the second image. The method also includes inputting the information into a learning based model. The learning based model is included in one or more components executed by one or more computer systems. The learning based model is configured for transforming one or more of the at least first and second images to thereby render the at least the first and second images into a common space. In addition, the method includes aligning the at least the first and second images using results of the transforming. The method may also include generating an alignment metric using a classifier.
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公开(公告)号：US10712289B2
公开(公告)日：2020-07-14
申请号：US14809774
申请日：2015-07-27
IPC分类号： G01N21/95 , G01B11/14 , G03F7/20 , G01N21/956
摘要： Various embodiments for detecting defects on a wafer are provided. One method includes acquiring output generated by an inspection system for a wafer during an inspection process that is performed after at least first and second process steps have been performed on the wafer. The first and second process steps include forming first and second portions, respectively, of a design on the wafer. The first and second portions of the design are mutually exclusive in space on the wafer. The method also includes detecting defects on the wafer based on the output and determining positions of the defects with respect to the first and second portions of the design. In addition, the method includes associating different portions of the defects with the first or second process step based on the positions of the defects with respect to the first and second portions of the design.
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公开(公告)号：US10670536B2
公开(公告)日：2020-06-02
申请号：US16364098
申请日：2019-03-25
IPC分类号： G01N21/88 , G01N21/95 , G01N21/956
摘要： Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.
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公开(公告)号：US10605744B2
公开(公告)日：2020-03-31
申请号：US15865130
申请日：2018-01-08
发明人： Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
摘要： Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.
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公开(公告)号：US10599951B2
公开(公告)日：2020-03-24
申请号：US16364140
申请日：2019-03-25
发明人： Kris Bhaskar , Laurent Karsenti , Brad Ries , Lena Nicolaides , Richard (Seng Wee) Yeoh , Stephen Hiebert
IPC分类号： G06K9/62
摘要： Methods and systems for training a neural network for defect detection in low resolution images are provided. One system includes an inspection tool that includes high and low resolution imaging subsystems and one or more components that include a high resolution neural network and a low resolution neural network. Computer subsystem(s) of the system are configured for generating a training set of defect images. At least one of the defect images is generated synthetically by the high resolution neural network using an image generated by the high resolution imaging subsystem. The computer subsystem(s) are also configured for training the low resolution neural network using the training set of defect images as input. In addition, the computer subsystem(s) are configured for detecting defects on another specimen by inputting the images generated for the other specimen by the low resolution imaging subsystem into the trained low resolution neural network.
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公开(公告)号：US10483081B2
公开(公告)日：2019-11-19
申请号：US15247774
申请日：2016-08-25
发明人： Allen Park , Ajay Gupta , Jan Lauber
摘要： Methods and systems for determining parameter(s) of a process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for determining an area of a defect detected on a specimen. The computer subsystem(s) are also configured for correlating the area of the defect with information for a design for the specimen and determining a spatial relationship between the area of the defect and the information for the design based on results of the correlating. In addition, the computer subsystem(s) are configured for automatically generating a region of interest to be measured during a process performed for the specimen with a measurement subsystem based on the spatial relationship.
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公开(公告)号：US10393671B2
公开(公告)日：2019-08-27
申请号：US15140438
申请日：2016-04-27
IPC分类号： G01N21/00 , G01N21/95 , G06T7/00 , G01N21/956 , G01N21/88
摘要： Methods and systems for detecting defects on a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a pattern of interest (POI) within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for generating a POI reference image from two or more of the images generated at the multiple instances of the POI within the die. The computer subsystem(s) are further configured for comparing the images generated at the multiple instances of the POI within the die to the POI reference image and detecting defects in the multiple instances of the POI based on results of the comparing.
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公开(公告)号：US10365232B2
公开(公告)日：2019-07-30
申请号：US15939278
申请日：2018-03-29
发明人： Shishir Suman , Kenong Wu
IPC分类号： G01N21/956 , G01N21/95 , G01N23/2251 , G01N21/88
摘要： Methods and systems for transforming positions of defects detected on a wafer are provided. One method includes aligning output of an inspection subsystem for a first frame in a first swath in a first die in a first instance of a multi-die reticle printed on the wafer to the output for corresponding frames, swaths, and dies in other reticle instances printed on the wafer. The method also includes determining different swath coordinate offsets for each of the frames, respectively, in the other reticle instances based on the swath coordinates of the output for the frames and the corresponding frames aligned thereto and applying one of the different swath coordinate offsets to the swath coordinates reported for the defects based on the other reticle instances in which they are detected thereby transforming the swath coordinates for the defects from swath coordinates in the other reticle instances to the first reticle instance.
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公开(公告)号：US10181185B2
公开(公告)日：2019-01-15
申请号：US15402197
申请日：2017-01-09
发明人： Allen Park , Lisheng Gao , Ashok Kulkarni , Saibal Banerjee , Ping Gu , Songnian Rong , Kris Bhaskar
摘要： Methods and systems for detecting anomalies in images of a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated of a specimen by an imaging subsystem. The computer subsystem(s) are also configured for determining one or more characteristics of the acquired images. In addition, the computer subsystem(s) are configured for identifying anomalies in the images based on the one or more determined characteristics without applying a defect detection algorithm to the images or the one or more characteristics of the images.
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