Invention Grant
- Patent Title: Titanium based high-K dielectric films
- Patent Title (中): 钛基高K电介质膜
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Application No.: US13657782Application Date: 2012-10-22
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Publication No.: US08737036B2Publication Date: 2014-05-27
- Inventor: Hanhong Chen , Nobumichi Fuchigami , Imran Hashim , Edward L. Haywood , Pragati Kumar , Sandra G. Malhotra , Monica Sawkar Mathur , Prashant B. Phatak , Sunil Shanker
- Applicant: Intermolecular, Inc.
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01G4/30
- IPC: H01G4/30

Abstract:
This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on titanium oxide, to suppress the formation of anatase-phase titanium oxide and (b) related devices and structures. A metal-insulator-metal (“MIM”) stack is formed using an ozone pretreatment process of a bottom electrode (or other substrate) followed by an ALD process to form a TiO2 dielectric, rooted in the use of an amide-containing precursor. Following the ALD process, an oxidizing anneal process is applied in a manner is hot enough to heal defects in the TiO2 dielectric and reduce interface states between TiO2 and electrode; the anneal temperature is selected so as to not be so hot as to disrupt BEL surface roughness. Further process variants may include doping the titanium oxide, pedestal heating during the ALD process to 275-300 degrees Celsius, use of platinum or ruthenium for the BEL, and plural reagent pulses of ozone for each ALD process cycle. The process provides high deposition rates, and the resulting MIM structure has substantially no x-ray diffraction peaks associated with anatase-phase titanium oxide.
Public/Granted literature
- US20130044404A1 Titanium-Based High-K Dielectric Films Public/Granted day:2013-02-21
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