发明授权
US08741380B2 Fine metal structure, process for producing the same, fine metal mold and device
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精细金属结构,制造方法,精细金属模具及装置
- 专利标题: Fine metal structure, process for producing the same, fine metal mold and device
- 专利标题(中): 精细金属结构,制造方法,精细金属模具及装置
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申请号: US12859802申请日: 2010-08-20
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公开(公告)号: US08741380B2公开(公告)日: 2014-06-03
- 发明人: Hiroshi Yoshida , Haruo Akahoshi , Akihiro Miyauchi , Masahiko Ogino
- 申请人: Hiroshi Yoshida , Haruo Akahoshi , Akihiro Miyauchi , Masahiko Ogino
- 申请人地址: JP Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2003-431801 20031226
- 主分类号: A61M5/00
- IPC分类号: A61M5/00 ; A61M5/32
摘要:
A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.
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