公开(公告)号：US08741380B2

公开(公告)日：2014-06-03

申请号：US12859802

申请日：2010-08-20

申请人： Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

发明人： Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

IPC分类号： A61M5/00 ,  A61M5/32

CPC分类号： B29C33/3842 ,  B29C33/424 ,  B81B2203/0361 ,  B81C1/00111 ,  B81C1/00206 ,  B81C99/0085 ,  B81C99/009 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1657 ,  C23C18/1689 ,  C23C18/208 ,  C23C18/42 ,  G03F7/0002 ,  H01J1/304 ,  H01J9/025 ,  Y10T428/12389 ,  Y10T428/12993

摘要： A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.

摘要翻译： 精细的金属结构，其表面具有高强度，高精度和大纵横比的微喷射体; 以及没有缺陷的金属微细结构的制造方法。 提供了具有微喷射体的表面的细金属结构，其特征在于，微喷射体具有10纳米至10微米的最小厚度或最小直径，并且微喷射体的最小厚度或最小直径（D）与高度 的微喷射体（H）H / D大于1.还提供了一种制造精细金属结构的方法，其特征在于，在其表面上提供具有细凹凸图案的基板，将分子无电镀催化剂 然后进行无电解电镀，从而形成具有凹凸图案的金属层，并将金属层与基板分离，从而获得配备有经过上述凹凸图案的反转传送的表面的精细金属结构。

公开(公告)号：US20100310773A1

公开(公告)日：2010-12-09

申请号：US12859802

申请日：2010-08-20

申请人： Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

发明人： Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

IPC分类号： B05D3/10

CPC分类号： B29C33/3842 ,  B29C33/424 ,  B81B2203/0361 ,  B81C1/00111 ,  B81C1/00206 ,  B81C99/0085 ,  B81C99/009 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1657 ,  C23C18/1689 ,  C23C18/208 ,  C23C18/42 ,  G03F7/0002 ,  H01J1/304 ,  H01J9/025 ,  Y10T428/12389 ,  Y10T428/12993

摘要： A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.

摘要翻译： 精细的金属结构，其表面具有高强度，高精度和大纵横比的微喷射体; 以及没有缺陷的金属微细结构的制造方法。 提供了具有微喷射体的表面的细金属结构，其特征在于，微喷射体具有10纳米至10微米的最小厚度或最小直径，并且微喷射体的最小厚度或最小直径（D）与高度 的微喷射体（H）H / D大于1.还提供了一种制造精细金属结构的方法，其特征在于，在其表面上提供具有细凹凸图案的基板，将分子无电镀催化剂 然后进行无电解电镀，从而形成具有凹凸图案的金属层，并将金属层与基板分离，从而获得配备有经过上述凹凸图案的反转传送的表面的精细金属结构。

公开(公告)号：US20120067507A1

公开(公告)日：2012-03-22

申请号：US13307042

申请日：2011-11-30

申请人： Masahiko OGINO ,  Mitsuru Hasegawa ,  Kenya Ohashi ,  Akihiro Miyauchi ,  Hitoshi Suzuki ,  Toshio Haba ,  Haruo Akahoshi

发明人： Masahiko OGINO ,  Mitsuru Hasegawa ,  Kenya Ohashi ,  Akihiro Miyauchi ,  Hitoshi Suzuki ,  Toshio Haba ,  Haruo Akahoshi

IPC分类号： B29C33/42 ,  B29C65/00

CPC分类号： B29C33/3878 ,  B29C33/424 ,  C25D1/02 ,  C25D1/10 ,  Y10S425/81 ,  Y10T29/49549 ,  Y10T29/49552

摘要： The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.

摘要翻译： 包括辊，具有内周面的缓冲管的精细图案模具与辊的外周面接触，并且压模管的内周面与缓冲管的外周面接触 并且在其外周面上形成微细的凹凸图案，其中缓冲管具有比压模管更大的线膨胀系数和更小的弹性模量。

公开(公告)号：US08387255B2

公开(公告)日：2013-03-05

申请号：US13307042

申请日：2011-11-30

申请人： Masahiko Ogino ,  Mitsuru Hasegawa ,  Kenya Ohashi ,  Akihiro Miyauchi ,  Hitoshi Suzuki ,  Toshio Haba ,  Haruo Akahoshi

发明人： Masahiko Ogino ,  Mitsuru Hasegawa ,  Kenya Ohashi ,  Akihiro Miyauchi ,  Hitoshi Suzuki ,  Toshio Haba ,  Haruo Akahoshi

IPC分类号： G11B7/26 ,  B29C33/38 ,  B29C59/04

CPC分类号： B29C33/3878 ,  B29C33/424 ,  C25D1/02 ,  C25D1/10 ,  Y10S425/81 ,  Y10T29/49549 ,  Y10T29/49552

摘要： The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.

摘要翻译： 包括辊，具有内周面的缓冲管的精细图案模具与辊的外周面接触，并且压模管的内周面与缓冲管的外周面接触 并且在其外周面上形成微细的凹凸图案，其中缓冲管具有比压模管更大的线膨胀系数和更小的弹性模量。

公开(公告)号：US08083515B2

公开(公告)日：2011-12-27

申请号：US12129881

申请日：2008-05-30

申请人： Masahiko Ogino ,  Mitsuru Hasegawa ,  Kenya Ohashi ,  Akihiro Miyauchi ,  Hitoshi Suzuki ,  Toshio Haba ,  Haruo Akahoshi

发明人： Masahiko Ogino ,  Mitsuru Hasegawa ,  Kenya Ohashi ,  Akihiro Miyauchi ,  Hitoshi Suzuki ,  Toshio Haba ,  Haruo Akahoshi

IPC分类号： B29C43/46 ,  B29C59/04

CPC分类号： B29C33/3878 ,  B29C33/424 ,  C25D1/02 ,  C25D1/10 ,  Y10S425/81 ,  Y10T29/49549 ,  Y10T29/49552

摘要： The fine pattern mold comprises: that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.

摘要翻译： 精细图案模具包括：包括辊，具有内周表面的缓冲管与辊的外周表面接触;以及压模管，其内周表面与所述辊的外周表面接触 在其外周面形成有缓冲管和细凹凸图案，其中缓冲管具有比压模管更大的线膨胀系数和更小的弹性模量。

公开(公告)号：US20080299247A1

公开(公告)日：2008-12-04

申请号：US12129881

申请日：2008-05-30

申请人： Masahiko Ogino ,  Mitsuru Hasegawa ,  Kenya Ohashi ,  Akihiro Miyauchi ,  Hitoshi Suzuki ,  Toshio Haba ,  Haruo Akahoshi

发明人： Masahiko Ogino ,  Mitsuru Hasegawa ,  Kenya Ohashi ,  Akihiro Miyauchi ,  Hitoshi Suzuki ,  Toshio Haba ,  Haruo Akahoshi

IPC分类号： B29C33/42 ,  C25D1/10

CPC分类号： B29C33/3878 ,  B29C33/424 ,  C25D1/02 ,  C25D1/10 ,  Y10S425/81 ,  Y10T29/49549 ,  Y10T29/49552

摘要： There is provided a fine pattern mold capable of transferring a fine concave/convex pattern accurately without causing deformation of the fine concave/convex pattern itself.The fine patter mold comprises: a roll; a buffer tube whose inner peripheral surface is in contact with an outer peripheral surface of the roll; and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.

摘要翻译： 提供了能够精确地转印精细凹凸图案的精细图案模具，而不会导致精细凹凸图案本身的变形。 精细模具包括：卷; 缓冲管，其内周面与所述辊的外周面接触; 以及其内周面与缓冲管的外周面接触的压模管，在其外周面上形成微细的凹凸图案，其中缓冲管具有较大的线膨胀系数和 比压模管的弹性模量小。

公开(公告)号：US06940162B2

公开(公告)日：2005-09-06

申请号：US10840605

申请日：2004-05-07

申请人： Shuji Eguchi ,  Akira Nagai ,  Haruo Akahoshi ,  Takumi Ueno ,  Toshiya Satoh ,  Masahiko Ogino ,  Asao Nishimura ,  Ichiro Anjo ,  Hideki Tanaka

发明人： Shuji Eguchi ,  Akira Nagai ,  Haruo Akahoshi ,  Takumi Ueno ,  Toshiya Satoh ,  Masahiko Ogino ,  Asao Nishimura ,  Ichiro Anjo ,  Hideki Tanaka

IPC分类号： H01L21/56 ,  H01L23/42 ,  H01L23/433 ,  H01L25/065 ,  H01L23/34 ,  H01L23/48

CPC分类号： H01L23/42 ,  H01L21/56 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/20752

摘要： In a multi chip module of a structure wherein a plurality of bare or packaged semiconductor chips are mounted on a single wiring board and upper surfaces of the semiconductor chips are covered with a single heat spread plate, the whole space around the semiconductor chips thus sandwiched between the wiring board and the heat spread plate is filled with resin.By so doing, the semiconductor chips are interconnected through the resin, so that even if a stress is exerted on any of the chips, it is dispersed and therefore it is possible to diminish the occurrence of cracks in the chips and the heat spread plate caused by stress concentration. Besides, since the semiconductor chips and the heat spread plate are bonded together with resin, even if there are variations in size of the chips, both can be bonded easily. Further, the bonding of all the chips and the heat spread plate can be done in a single process.

摘要翻译： 在多个裸片或封装的半导体芯片安装在单个布线板上并且半导体芯片的上表面被一个单独的散热板覆盖的结构的多芯片模块中，由此夹在半导体芯片周围的整个空间 布线板和扩散板填充树脂。 通过这样做，半导体芯片通过树脂互连，使得即使在任何芯片上施加应力，它也被分散，因此可以减少芯片和散热板中的裂纹的发生 通过压力集中。 此外，由于半导体芯片和扩散板与树脂粘合在一起，即使芯片的尺寸有变化，两者也可以容易地结合。 此外，所有芯片和散热板的接合可以在单个工艺中完成。

公开(公告)号：US06396145B1

公开(公告)日：2002-05-28

申请号：US09446979

申请日：1999-12-30

申请人： Akira Nagai ,  Takumi Ueno ,  Haruo Akahoshi ,  Syuji Eguchi ,  Masahiko Ogino ,  Toshiya Satoh ,  Asao Nishimura ,  Ichiro Anjoh

发明人： Akira Nagai ,  Takumi Ueno ,  Haruo Akahoshi ,  Syuji Eguchi ,  Masahiko Ogino ,  Toshiya Satoh ,  Asao Nishimura ,  Ichiro Anjoh

IPC分类号： H01L2348

CPC分类号： H01L23/3171 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/02145 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/08225 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor element arranged to form integrated circuitry, a plurality of electrode pads formed on the side of the integrated circuitry formation surface of the in semiconductor element, bump electrodes for external connection electrically connected to the electrode pads through a conductive layer, and a stress relaxation layer formed between the integrated circuitry formation surface and electrode pads on one hand and the bump electrodes and conductive layer on the other hand, the stress relaxation layer being adhered thereto, wherein more than one third of the stress relaxation layer from a surface thereof is cut away for removal and wherein the stress relaxation layer is subdivided into a plurality of regions.

摘要翻译： 半导体器件包括布置成形成集成电路的半导体元件，形成在半导体元件的集成电路形成表面侧的多个电极焊盘，用于通过导电层电连接到电极焊盘的用于外部连接的凸起电极， 以及一方面在集成电路形成表面和电极焊盘之间形成的应力松弛层，另一方面在凸起电极和导电层之间形成应力松弛层，应力松弛层粘附到其上，其中来自一个或多个应力松弛层的三分之一以上 其表面被切除以除去，并且其中应力松弛层被细分为多个区域。

公开(公告)号：US06627997B1

公开(公告)日：2003-09-30

申请号：US09463431

申请日：2000-01-27

申请人： Shuji Eguchi ,  Akira Nagai ,  Haruo Akahoshi ,  Takumi Ueno ,  Toshiya Satoh ,  Masahiko Ogino ,  Asao Nishimura ,  Ichiro Anjo ,  Hideki Tanaka

发明人： Shuji Eguchi ,  Akira Nagai ,  Haruo Akahoshi ,  Takumi Ueno ,  Toshiya Satoh ,  Masahiko Ogino ,  Asao Nishimura ,  Ichiro Anjo ,  Hideki Tanaka

IPC分类号： H01L2348

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2225/1005 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： In a multi-chip module, a plurality of semiconductor chips are mounted on a single wiring board. Upper surfaces of the semiconductor chips are covered with a single heat spread plate, and the whole space around the semiconductor chips, sandwiched between the wiring board and the heat spread plate, is filled with resin. The semiconductor chips are interconnected through the resin so that any stress exerted on any chips is dispersed. This diminishes the occurrence of cracks caused by stress concentration. Since the semiconductor chips and the heat spread plate are bonded together with resin, even if there are variations in size of the chips, both can be bonded easily. Further, the bonding of all the chips and the heat spread plate can be done in a single process.

摘要翻译： 在多芯片模块中，多个半导体芯片安装在单个布线板上。 半导体芯片的上表面被单个扩散板覆盖，并且夹在布线板和扩散板之间的半导体芯片周围的整个空间填充有树脂。 半导体芯片通过树脂相互连接，从而分散施加在任何芯片上的任何应力。 这减少了由应力集中引起的裂纹的发生。 由于半导体芯片和热扩散板与树脂粘合在一起，即使芯片的尺寸有变化，两者也可以容易地结合。 此外，所有芯片和散热板的接合可以在单个工艺中完成。

公开(公告)号：US6028364A

公开(公告)日：2000-02-22

申请号：US809233

申请日：1997-03-19

申请人： Masahiko Ogino ,  Akira Nagai ,  Shuji Eguchi ,  Toshiaki Ishii ,  Masanori Segawa ,  Haruo Akahoshi ,  Akio Takahashi ,  Takao Miwa ,  Naotaka Tanaka ,  Ichirou Anjou

发明人： Masahiko Ogino ,  Akira Nagai ,  Shuji Eguchi ,  Toshiaki Ishii ,  Masanori Segawa ,  Haruo Akahoshi ,  Akio Takahashi ,  Takao Miwa ,  Naotaka Tanaka ,  Ichirou Anjou

IPC分类号： H01L23/498 ,  H01L23/48 ,  H01L23/52 ,  H05K1/00 ,  H05K7/20

CPC分类号： H01L23/49827 ,  H01L23/49816 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351

摘要： A semiconductor device has a multi-layered wiring structure having a conductor layer to be electrically connected to a packaging substrate, the structure being provided on a circuit formation surface of a semiconductor chip; and ball-like terminals disposed in a grid array on the surface of the multi-layered wiring structure on the packaging substrate side, wherein the multi-layered wiring structure includes a buffer layer for relieving a thermal stress produced between the semiconductor chip and the packaging substrate, after packaging thereof, and multiple wiring layers. In this semiconductor device, the wiring distance is shorter than that of a conventional semiconductor device, so that an inductance component becomes smaller, to thereby increase the signal speed; the distance between a ground layer and a power supply layer is shortened, to reduce noise produced upon operation, and also a thermal stress upon packaging is relieved by the buffer layer of the multi-layered wiring structure, resulting in the improved connection reliability; and the number of terminals per unit is increased because of elimination of wire bonding.

摘要翻译： PCT No.PCT / JP95 / 00714 Sec。 371日期1997年3月19日 102（e）1997年3月19日PCT提交1995年4月12日PCT公布。 出版物WO96 / 09645 日期：1996年3月28日半导体器件具有多层布线结构，具有与封装基板电连接的导体层，该结构设置在半导体芯片的电路形成面上; 以及设置在所述多层布线结构体的所述封装基板侧的表面上的栅格阵列中的球状端子，其中所述多层布线结构包括用于缓解在所述半导体芯片和所述封装之间产生的热应力的缓冲层 基板，其包装之后，以及多个布线层。 在该半导体装置中，布线距离短于以往的半导体装置，因此电感成分变小，信号速度变高; 接地层和电源层之间的距离缩短，以减少操作时产生的噪声，并且通过多层布线结构的缓冲层减轻了包装上的热应力，从而提高了连接可靠性; 并且由于引线接合的消除，每单元的端子数量增加。