Invention Grant
- Patent Title: Adhesive film and method of encapsulating organic electrode device using the same
- Patent Title (中): 粘合膜和使用其的包封有机电极装置的方法
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Application No.: US13886098Application Date: 2013-05-02
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Publication No.: US08742411B2Publication Date: 2014-06-03
- Inventor: Hyun Jee Yoo , Yoon Gyung Cho , Jung Sup Shim , Suk Chin Lee , Kwang Jin Jeong , Suk Ky Chang
- Applicant: LG Chem, Ltd.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna, Long & Aldridge, LLP.
- Priority: KR10-2010-0108113 20101102; KR10-2011-0004054 20110114; KR10-2011-0113121 20111102
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L35/24 ; H01L51/00 ; H01L33/00
Abstract:
An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.
Public/Granted literature
- US20130240862A1 ADHESIVE FILM AND METHOD OF ENCAPSULATING ORGANIC ELECTRODE DEVICE USING THE SAME Public/Granted day:2013-09-19
Information query
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