公开(公告)号：US11909053B2

公开(公告)日：2024-02-20

申请号：US16965092

申请日：2019-02-19

Applicant: LG Chem, Ltd.

Inventor： Yoon Gyung Cho ,  Se Woo Yang ,  Yang Gu Kang ,  Eun Suk Park ,  Hyun Suk Kim ,  Hyoung Sook Park ,  Sang Min Park ,  Young Jo Yang

IPC: H01M50/116 ,  H01M50/278 ,  C08G18/42 ,  C08G18/32 ,  C08G18/73 ,  C08G18/66 ,  C08K3/22 ,  H01M50/211 ,  H01M50/227 ,  B60L50/60

CPC classification number: H01M50/116 ,  C08G18/3206 ,  C08G18/4277 ,  C08G18/664 ,  C08G18/73 ,  C08K3/22 ,  H01M50/211 ,  H01M50/227 ,  H01M50/278 ,  B60L50/60 ,  C08K2003/2227

Abstract: The present application relates to a resin composition, a battery module comprising a cured product of the resin composition, a manufacturing method thereof and a battery pack. According to one example of the present application, injection processability of the resin composition can be improved, overloading of injection equipment can be prevented, and the battery module having excellent insulation properties can be provided.

公开(公告)号：US11603451B2

公开(公告)日：2023-03-14

申请号：US16645676

申请日：2019-03-19

Applicant: LG Chem, Ltd.

Inventor： Yoon Gyung Cho ,  Se Woo Yang ,  Yang Gu Kang ,  Eun Suk Park ,  Hyun Suk Kim ,  Hyoung Sook Park ,  Sang Min Park ,  Young Jo Yang

IPC: C08K5/521 ,  C08G18/42 ,  C08G18/73 ,  H01M50/116 ,  C08L75/06 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38

Abstract: The present application relates to an adhesive composition capable of fixing a battery cell in a battery module and a battery pack. According to one example of the present application, there is provided a two-component urethane-based adhesive composition which has excellent storage stability and processability and is capable of providing physical properties required in related uses in a short time.

公开(公告)号：US10570321B2

公开(公告)日：2020-02-25

申请号：US16414163

申请日：2019-05-16

Applicant: LG CHEM, LTD.

Inventor： Yoon Gyung Cho ,  Kyung Yul Bae ,  Hyun Jee Yoo

IPC: C09J9/00 ,  C09J109/00 ,  H01L51/56 ,  C09J145/00 ,  H01L51/00 ,  C09J123/22 ,  C09J133/08 ,  H01L51/52 ,  C09J4/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/00

Abstract: Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

公开(公告)号：US10442960B2

公开(公告)日：2019-10-15

申请号：US15580498

申请日：2016-06-09

Applicant: LG CHEM, LTD.

Inventor： Kyung Yul Bae ,  Yoon Gyung Cho ,  Hyun Jee Yoo ,  Se Woo Yang

IPC: C09J7/38 ,  C09J4/00 ,  C09J123/22 ,  C09J7/20 ,  H01L51/00 ,  H01L51/52 ,  C09J109/00 ,  C09J163/00 ,  H05K1/02 ,  H05K1/03 ,  C09J7/30 ,  C08G59/40 ,  C09J4/06 ,  H05K3/28 ,  C09J11/08

Abstract: The present application relates to an adhesive film, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The present application enables an organic electronic device to show excellent moisture-blocking properties and have flexibility as well as excellent and reliable durability at high temperature and high humidity.

公开(公告)号：US10351738B2

公开(公告)日：2019-07-16

申请号：US14762389

申请日：2014-08-05

Applicant: LG CHEM, LTD.

Inventor： Kyung Yul Bae ,  Hyun Jee Yoo ,  Yoon Gyung Cho ,  Se Woo Yang

IPC: C09J123/22 ,  C09J109/00 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  C09J9/00 ,  C09J4/00 ,  C09J7/00 ,  C09J133/08 ,  C09J145/00 ,  C09J7/20 ,  C09J7/10

Abstract: Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen from penetrating into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

公开(公告)号：US10336917B2

公开(公告)日：2019-07-02

申请号：US14764119

申请日：2014-08-05

Applicant: LG CHEM, LTD.

Inventor： Yoon Gyung Cho ,  Kyung Yul Bae ,  Hyun Jee Yoo

IPC: C09J109/00 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  C09J9/00 ,  C09J4/00 ,  C09J7/00 ,  C09J123/22 ,  C09J133/08 ,  C09J145/00 ,  C09J7/20 ,  C09J7/10

Abstract: Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

公开(公告)号：US10050204B2

公开(公告)日：2018-08-14

申请号：US14762399

申请日：2014-07-21

Applicant: LG CHEM, LTD.

Inventor： Seung Min Lee ,  Suk Ky Chang ,  Min Soo Park ,  Hyun Jee Yoo ,  Jung Sup Shim ,  Yoon Gyung Cho ,  Kyung Yul Bae ,  Hyun Suk Kim ,  Jung Ok Moon

IPC: C08L23/22 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56 ,  C09J133/06 ,  C09J123/22 ,  C08L101/00 ,  C08F220/18

Abstract: An encapsulation composition, an encapsulation film including the same, an encapsulation product for organic electronic devices, and a method of manufacturing an organic electronic device are provided. The encapsulation composition can be useful in effectively preventing moisture or oxygen from flowing into the organic electronic device from external environments while realizing transparency when the organic electronic device is encapsulated by the encapsulation composition. Also, the encapsulation film formed of the encapsulation composition can be useful in ensuring mechanical properties such as handling properties and processability, and the organic electronic device whose encapsulation structure is formed by means of the encapsulation film may have improved lifespan and durability, thereby providing an encapsulation product for organic electronic devices showing high reliability.

公开(公告)号：US20160130476A1

公开(公告)日：2016-05-12

申请号：US14939857

申请日：2015-11-12

Applicant: LG CHEM, LTD.

Inventor： Hyun Sup Lee ,  Yoon Gyung Cho ,  Myung Han Lee ,  Kyung Yul Bae ,  Sang Eun Kim ,  Sang Min Park ,  Se Woo Yang ,  Ye Hoon Im

IPC: C09J7/02 ,  C09J145/00 ,  H01L51/52 ,  C09J123/22

CPC classification number: H01L51/5253 ,  C08F220/18 ,  C09J4/06 ,  C09J7/22 ,  C09J7/38 ,  C09J123/22 ,  C09J145/00 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2409/00 ,  C09J2423/00

Abstract: The present application provides a pressure-sensitive adhesive film, an organic electronic device including the same and a method of manufacturing an organic electronic device using the same. The present application provides the pressure-sensitive adhesive film which forms a structure effectively blocking water or oxygen from penetrating into an organic electronic device from the outside, and has excellent mechanical properties such as handleability, formability or the like and transparency.

Abstract translation: 本申请提供了一种压敏粘合剂膜，包括该粘合剂膜的有机电子器件和使用其的有机电子器件的制造方法。 本申请提供了形成有效阻止水或氧从外部渗透到有机电子器件中的结构的压敏粘合剂膜，并且具有优异的机械性能如可操作性，成形性等等和透明性。

公开(公告)号：US09105648B2

公开(公告)日：2015-08-11

申请号：US14289212

申请日：2014-05-28

Applicant: LG Chem, Ltd.

Inventor： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Jung Sup Shim ,  Suk Chin Lee ,  Kwang Jin Jeong ,  Suk Ky Chang

IPC: H01L29/08 ,  H01L35/24 ,  H01L51/00 ,  H01L23/00 ,  H01L51/52 ,  H05B33/04 ,  H01L51/56 ,  C09J7/00 ,  C09J7/02 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C09J163/00 ,  C08K3/16

CPC classification number: H01L51/0094 ,  C08K3/16 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/162 ,  C08K2003/166 ,  C08K2003/2206 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/295 ,  H01L23/564 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract translation: 提供了一种粘合剂，以及使用其的封装产品和封装有机电子器件（OED）的方法。 粘合膜用于包封OED并且包括可固化树脂和吸湿剂，并且粘合剂包括在封装OED时与OED接触的第一区域和不与OED接触的第二区域。 此外，基于粘合剂中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。

公开(公告)号：US08742411B2

公开(公告)日：2014-06-03

申请号：US13886098

申请日：2013-05-02

Applicant: LG Chem, Ltd.

Inventor： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Jung Sup Shim ,  Suk Chin Lee ,  Kwang Jin Jeong ,  Suk Ky Chang

IPC: H01L29/08 ,  H01L35/24 ,  H01L51/00 ,  H01L33/00

CPC classification number: H01L51/0094 ,  C08K3/16 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/162 ,  C08K2003/166 ,  C08K2003/2206 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/295 ,  H01L23/564 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.

Abstract translation: 提供了一种粘合膜，以及使用其的封装有机电子器件（OED）的产品和方法。 粘合膜用于包封OED并且包括可固化的热熔粘合剂层，其包括可固化树脂和吸湿剂，并且可固化热熔粘合剂层包括在封装OED时与OED接触的第一区域，以及 第二个区域不与OED接触。 此外，基于粘合剂层中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。