Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13861005Application Date: 2013-04-11
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Publication No.: US08742497B2Publication Date: 2014-06-03
- Inventor: Hirokazu Sayama
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-094401 20120418
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device is provided, in which work of a parasitic bipolar transistor can be suppressed and a potential difference can be provided between a source region and a back gate region. A high voltage tolerant transistor formed over a semiconductor substrate includes: a well region of a first conductivity type; a first impurity region as the source region; and a second impurity region as a drain region. The semiconductor device further includes a third impurity region and a gate electrode for isolation. The third impurity region is formed, in planar view, between a pair of the first impurity regions, and from which a potential of the well region is extracted. The gate electrode for isolation is formed over the main surface between the first impurity region and the third impurity region.
Public/Granted literature
- US20130277738A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-10-24
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