Invention Grant
US08742513B2 Semiconductor device comprising metal gates and a silicon containing resistor formed on an isolation structure 有权
半导体器件包括金属栅极和形成在隔离结构上的含硅电阻器

  • Patent Title: Semiconductor device comprising metal gates and a silicon containing resistor formed on an isolation structure
  • Patent Title (中): 半导体器件包括金属栅极和形成在隔离结构上的含硅电阻器
  • Application No.: US13628468
    Application Date: 2012-09-27
  • Publication No.: US08742513B2
    Publication Date: 2014-06-03
  • Inventor: Andy WeiAndrew Waite
  • Applicant: GLOBALFOUNDRIES Inc.
  • Applicant Address: KY Grand Cayman
  • Assignee: GLOBALFOUNDRIES Inc.
  • Current Assignee: GLOBALFOUNDRIES Inc.
  • Current Assignee Address: KY Grand Cayman
  • Agency: Amerson Law Firm, PLLC
  • Priority: DE102009021485 20090515
  • Main IPC: H01L27/11
  • IPC: H01L27/11
Semiconductor device comprising metal gates and a silicon containing resistor formed on an isolation structure
Abstract:
In a semiconductor device comprising sophisticated high-k metal gate structures formed in accordance with a replacement gate approach, semiconductor-based resistors may be formed above isolation structures substantially without being influenced by the replacement gate approach. Consequently, enhanced area efficiency may be achieved compared to conventional strategies, in which the resistive structures may have to be provided on the basis of a gate electrode metal, while, nevertheless, a low parasitic capacitance may be accomplished due to providing the resistive structures above the isolation structure.
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