发明授权
- 专利标题: Lead apparatus
- 专利标题(中): 铅装置
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申请号: US12795236申请日: 2010-06-07
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公开(公告)号: US08744548B2公开(公告)日: 2014-06-03
- 发明人: Rogier Receveur , Jean Joseph Gerardus Rutten , Karel F. A. A. Smits , Nicolaas M Lokhoff , Sylvia Weijzen-Engels , Didier Billy , Tim Dirk Jan Jongen , Lilian Kornet
- 申请人: Rogier Receveur , Jean Joseph Gerardus Rutten , Karel F. A. A. Smits , Nicolaas M Lokhoff , Sylvia Weijzen-Engels , Didier Billy , Tim Dirk Jan Jongen , Lilian Kornet
- 申请人地址: US MN Minneapolis
- 专利权人: Medtronic, Inc.
- 当前专利权人: Medtronic, Inc.
- 当前专利权人地址: US MN Minneapolis
- 代理商 Reed A. Duthler
- 主分类号: A61B5/042
- IPC分类号: A61B5/042 ; A61N1/05
摘要:
A lead including one or more electrodes having circuitry associated therewith. Each such electrode includes a circuit extending along and conforming to at least a portion of an inner surface of the electrode. The circuit includes an isolation substrate contacting at least a portion of the inner surface of the cylindrical electrode portion, a first contact electrically isolated from the electrode portion by the isolation substrate and an integrated circuit electrically coupled to the first contact and the electrode.
公开/授权文献
- US20110024186A1 LEAD APPARATUS 公开/授权日:2011-02-03
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