Invention Grant
- Patent Title: Method for epitaxial devices
- Patent Title (中): 外延装置的方法
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Application No.: US13901767Application Date: 2013-05-24
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Publication No.: US08748321B2Publication Date: 2014-06-10
- Inventor: Anton deVilliers , Erik Byers , Scott E. Sills
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/311
- IPC: H01L21/311

Abstract:
Epitaxial growth methods and devices are described that include a textured surface on a substrate. Geometry of the textured surface provides a reduced lattice mismatch between an epitaxial material and the substrate. Devices formed by the methods described exhibit better interfacial adhesion and lower defect density than devices formed without texture. Silicon substrates are shown with gallium nitride epitaxial growth and devices such as LEDs are formed within the gallium nitride.
Public/Granted literature
- US20130256692A1 EPITAXIAL DEVICES Public/Granted day:2013-10-03
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