发明授权
- 专利标题: Method of manufacturing semiconductor device
- 专利标题(中): 制造半导体器件的方法
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申请号: US13413686申请日: 2012-03-07
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公开(公告)号: US08753928B2公开(公告)日: 2014-06-17
- 发明人: Shunpei Yamazaki , Yuhei Sato , Keiji Sato , Tetsunori Maruyama
- 申请人: Shunpei Yamazaki , Yuhei Sato , Keiji Sato , Tetsunori Maruyama
- 申请人地址: JP Atsugi-shi, Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi, Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权: JP2011-054815 20110311
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/84
摘要:
In a process of manufacturing a transistor including an oxide semiconductor layer, an amorphous oxide semiconductor layer which includes a region containing excess oxygen as compared to a stoichiometric composition ratio of an oxide semiconductor in a crystalline state is formed over a silicon oxide film, an aluminum oxide film is formed over the amorphous oxide semiconductor layer, and then heat treatment is performed so that at least part of the amorphous oxide semiconductor layer is crystallized and an oxide semiconductor layer which includes a crystal having a c-axis substantially perpendicular to a surface of the oxide semiconductor layer is formed.
公开/授权文献
- US20120231581A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 公开/授权日:2012-09-13
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