Invention Grant
US08758512B2 Vapor deposition reactor and method for forming thin film 有权
蒸镀反应器及薄膜形成方法

  • Patent Title: Vapor deposition reactor and method for forming thin film
  • Patent Title (中): 蒸镀反应器及薄膜形成方法
  • Application No.: US12794209
    Application Date: 2010-06-04
  • Publication No.: US08758512B2
    Publication Date: 2014-06-24
  • Inventor: Sang In Lee
  • Applicant: Sang In Lee
  • Applicant Address: US CA Fremont
  • Assignee: Veeco ALD Inc.
  • Current Assignee: Veeco ALD Inc.
  • Current Assignee Address: US CA Fremont
  • Agency: Fenwick & West LLP
  • Main IPC: C23C16/00
  • IPC: C23C16/00
Vapor deposition reactor and method for forming thin film
Abstract:
A vapor deposition reactor and a method for forming a thin film. The vapor deposition reactor includes at least one first injection portion for injecting a reacting material to a recess in a first portion of the vapor deposition reactor. A second portion is connected to the first space and has a recess connected to the recess of the first portion. The recess of the second portion is maintained to have pressure lower than the pressure in the first space. A third portion is connected to the second space, and an exhaust portion is connected to the third space.
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