Invention Grant
- Patent Title: Contactless communications using ferromagnetic material
- Patent Title (中): 使用铁磁材料的非接触式通信
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Application No.: US13206584Application Date: 2011-08-10
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Publication No.: US08760255B2Publication Date: 2014-06-24
- Inventor: Ping-Lin Yang , Jun-De Jin , Fu-Lung Hsueh , Sa-Lly Liu , Tong-Chern Ong , Chun-Jung Lin , Ya-Chen Kao
- Applicant: Ping-Lin Yang , Jun-De Jin , Fu-Lung Hsueh , Sa-Lly Liu , Tong-Chern Ong , Chun-Jung Lin , Ya-Chen Kao
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Agent Steven E. Koffs
- Main IPC: H01F5/00
- IPC: H01F5/00

Abstract:
A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils.
Public/Granted literature
- US20130038418A1 CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL Public/Granted day:2013-02-14
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