Invention Grant
- Patent Title: Electrochemical device and manufacturing method thereof, circuit board and housing tray
- Patent Title (中): 电化学装置及其制造方法，电路板和外壳托盘
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Application No.: US13085735Application Date: 2011-04-13
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Publication No.: US08760840B2Publication Date: 2014-06-24
- Inventor: Hiroaki Hasegawa , Hidetake Itoh , Yoshihiko Ohashi , Kazuo Katai , Yosuke Miyaki
- Applicant: Hiroaki Hasegawa , Hidetake Itoh , Yoshihiko Ohashi , Kazuo Katai , Yosuke Miyaki
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2010-093400 20100414; JP2010-093409 20100414; JP2010-093468 20100414; JP2010-093472 20100414
- Main IPC: H01G2/02
- IPC: H01G2/02 ; H01G9/06 ; H01G4/228 ; H01G9/10 ; H05K5/03 ; H01R9/00
Abstract:
A lead 3 of an electrochemical device includes a lead body 3A containing Al, and a bent metallic thin film 3a provided to a tip part of the lead body 3A. The metallic thin film 3a includes a thin film body 3a1 containing Ni, and a plating layer 3a2 containing Sn and covering at least an outer surface of the bent thin film body 3a1. A specific area of an inner surface of the bent thin film body 3a1 and a surface of the lead body 3A are welded in a predetermined area without the plating layer 3a2 being disposed there between.
Public/Granted literature
- US20110253436A1 ELECTROCHEMICAL DEVICE AND MANUFACTURING METHOD THEREOF, CIRCUIT BOARD AND HOUSING TRAY Public/Granted day:2011-10-20
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