发明授权
- 专利标题： Electrochemical device and manufacturing method thereof, circuit board and housing tray
- 专利标题（中）： 电化学装置及其制造方法，电路板和外壳托盘
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申请号： US13085735申请日： 2011-04-13
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公开(公告)号： US08760840B2公开(公告)日： 2014-06-24
- 发明人: Hiroaki Hasegawa , Hidetake Itoh , Yoshihiko Ohashi , Kazuo Katai , Yosuke Miyaki
- 申请人： Hiroaki Hasegawa , Hidetake Itoh , Yoshihiko Ohashi , Kazuo Katai , Yosuke Miyaki
- 申请人地址： JP Tokyo
- 专利权人： TDK Corporation
- 当前专利权人： TDK Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff PLC
- 优先权： JP2010-093400 20100414; JP2010-093409 20100414; JP2010-093468 20100414; JP2010-093472 20100414
- 主分类号： H01G2/02
- IPC分类号： H01G2/02 ; H01G9/06 ; H01G4/228 ; H01G9/10 ; H05K5/03 ; H01R9/00
摘要：
A lead 3 of an electrochemical device includes a lead body 3A containing Al, and a bent metallic thin film 3a provided to a tip part of the lead body 3A. The metallic thin film 3a includes a thin film body 3a1 containing Ni, and a plating layer 3a2 containing Sn and covering at least an outer surface of the bent thin film body 3a1. A specific area of an inner surface of the bent thin film body 3a1 and a surface of the lead body 3A are welded in a predetermined area without the plating layer 3a2 being disposed there between.
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