Invention Grant
- Patent Title: Prediction and compensation of erosion in a magnetron sputtering target
- Patent Title (中): 磁控溅射靶的侵蚀预测与补偿
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Application No.: US13898311Application Date: 2013-05-20
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Publication No.: US08764949B2Publication Date: 2014-07-01
- Inventor: Keith A. Miller , Daniel C. Lubben
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Charles S. Guenzer
- Main IPC: C23C14/00
- IPC: C23C14/00 ; C23C14/32 ; C25B9/00 ; C25B11/00 ; C25B13/00

Abstract:
When a magnetron is scanned about the back of a target in a selected complex path having radial components, the erosion profile has a form depending upon the selection of paths. A radial erosion rate profile for a given magnetron is measured. Periodically during scanning, an erosion profile is calculated from the measured erosion rate profile, the time the magnetron spends at different radii, and the target power. The calculated erosion profile may be used to indicate when erosion has become excessive at any location prompting target replacement or to adjust the height of the magnetron above the target for repeated scans. In another aspect of the invention, the magnetron height is dynamically adjusted during a scan to compensate for erosion. The compensation may be based on the calculated erosion profile or on feedback control of the present value of the target voltage for a constant-power target supply.
Public/Granted literature
- US20130313107A1 Prediction and compensation of erosion in a magnetron sputtering target Public/Granted day:2013-11-28
Information query
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