发明授权
- 专利标题： Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposer
- 专利标题（中）： 制造集成电路封装系统的方法，包括通过封装在内插器上的激光
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申请号： US13162566申请日： 2011-06-16
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公开(公告)号： US08765525B2公开(公告)日： 2014-07-01
- 发明人: In Sang Yoon , DeokKyung Yang , Sungmin Song
- 申请人： In Sang Yoon , DeokKyung Yang , Sungmin Song
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.
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