公开(公告)号：US08765525B2

公开(公告)日：2014-07-01

申请号：US13162566

申请日：2011-06-16

申请人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

发明人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

IPC分类号： H01L21/00

CPC分类号： H01L23/481 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

摘要翻译： 一种集成包装系统的制造方法包括：提供基板; 在基板上安装集成电路; 在所述集成电路上安装具有插入器焊盘的插入器基板; 覆盖集成电路和插入器衬底上的密封剂; 通过所述密封剂形成穿过所述插入器衬垫的孔; 并且将导电连接器放置在与插入器垫直接接触的位置。

公开(公告)号：US09385066B1

公开(公告)日：2016-07-05

申请号：US14282598

申请日：2014-05-20

申请人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

发明人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L23/538

CPC分类号： H01L23/481 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

摘要翻译： 一种集成包装系统的制造方法包括：提供基板; 在基板上安装集成电路; 在所述集成电路上安装具有插入器焊盘的插入器基板; 覆盖集成电路和插入器衬底上的密封剂; 通过所述密封剂形成穿过所述插入器衬垫的孔; 并且将导电连接器放置在与插入器垫直接接触的位置。

公开(公告)号：US20120319265A1

公开(公告)日：2012-12-20

申请号：US13162566

申请日：2011-06-16

申请人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

发明人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

IPC分类号： H01L23/498 ,  H01L21/98

CPC分类号： H01L23/481 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

摘要翻译： 一种集成包装系统的制造方法包括：提供基板; 在基板上安装集成电路; 在所述集成电路上安装具有插入器焊盘的插入器基板; 覆盖集成电路和插入器基板上的密封剂; 通过所述密封剂形成穿过所述插入器衬垫的孔; 并且将导电连接器放置在与插入器垫直接接触的位置。

公开(公告)号：US08633100B2

公开(公告)日：2014-01-21

申请号：US13163643

申请日：2011-06-17

申请人： DeokKyung Yang ,  In Sang Yoon ,  SangJin Lee

发明人： DeokKyung Yang ,  In Sang Yoon ,  SangJin Lee

IPC分类号： H01L21/768

CPC分类号： H01L21/565 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/18161

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a connection post on the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; molding an encapsulation on the integrated circuit die and the connection post; and forming a connector recess in the encapsulation by removing the encapsulation around the connection post exposing a portion of the post side.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在所述基板上形成连接柱，所述连接柱具有柱顶和柱侧; 在基板上安装集成电路管芯，集成电路管芯具有顶部管芯表面; 在集成电路管芯和连接柱上成型封装; 以及通过去除暴露一部分柱侧的连接柱周围的封装而在封装中形成连接器凹部。

公开(公告)号：US20120319286A1

公开(公告)日：2012-12-20

申请号：US13163643

申请日：2011-06-17

申请人： DeokKyung Yang ,  In Sang Yoon ,  SangJin Lee

发明人： DeokKyung Yang ,  In Sang Yoon ,  SangJin Lee

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/18161

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a connection post on the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; molding an encapsulation on the integrated circuit die and the connection post; and forming a connector recess in the encapsulation by removing the encapsulation around the connection post exposing a portion of the post side.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在所述基板上形成连接柱，所述连接柱具有柱顶和柱侧; 在基板上安装集成电路管芯，集成电路管芯具有顶部管芯表面; 在集成电路管芯和连接柱上成型封装; 以及通过去除暴露一部分柱侧的连接柱周围的封装而在封装中形成连接器凹部。

公开(公告)号：US09905491B1

公开(公告)日：2018-02-27

申请号：US14039938

申请日：2013-09-27

申请人： In Sang Yoon ,  DeokKyung Yang ,  SeongHun Mun

发明人： In Sang Yoon ,  DeokKyung Yang ,  SeongHun Mun

IPC分类号： H01L21/50 ,  H01L23/538 ,  H01L23/31

CPC分类号： H01L23/3128

摘要： Semiconductor packages with multiple substrates can incorporate cavities in a portion of an upper substrate to minimize or reduce void formations during a molding process. The cavities can be formed substantially over the integrated circuit devices and not over the internal interconnects to further facilitate the flow of the molding compound. The combination with extension members or recesses on a top or exterior surface of the upper substrate can further cut down on bleeding or spill over of the molding compound between adjacent packages and improve device reliability and yield.

公开(公告)号：US08102666B2

公开(公告)日：2012-01-24

申请号：US12194506

申请日：2008-08-19

申请人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

发明人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

IPC分类号： H01L23/02

CPC分类号： H01L23/4334 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.

摘要翻译： 集成电路封装系统包括：连接载体和安装在其上的集成电路; 在集成电路上安装具有开口的插入器; 通过开口连接插入器和载体之间的互连; 并且形成与载体的载体垂直侧和插入器的插入器垂直侧的平坦的封装。

公开(公告)号：US09202715B2

公开(公告)日：2015-12-01

申请号：US13298267

申请日：2011-11-16

申请人： YoungChul Kim ,  KyungHoon Lee ,  Seong Won Park ,  Ki Youn Jang ,  JaeHyun Lee ,  DeokKyung Yang ,  In Sang Yoon ,  SungEun Park

发明人： YoungChul Kim ,  KyungHoon Lee ,  Seong Won Park ,  Ki Youn Jang ,  JaeHyun Lee ,  DeokKyung Yang ,  In Sang Yoon ,  SungEun Park

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a connection post to the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; and forming a package body on the substrate, the connection post, and the integrated circuit die.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 将连接柱附接到所述基板，所述连接柱具有柱顶和柱侧; 在基板上安装集成电路管芯，集成电路管芯具有顶部管芯表面; 以及在所述基板，所述连接柱和所述集成电路管芯上形成封装体。

公开(公告)号：US07875967B2

公开(公告)日：2011-01-25

申请号：US12045646

申请日：2008-03-10

申请人： DeokKyung Yang ,  In Sang Yoon ,  Jae Han Chung

发明人： DeokKyung Yang ,  In Sang Yoon ,  Jae Han Chung

IPC分类号： H01L23/02 ,  H01L29/40 ,  H01L23/28

CPC分类号： H01L23/3128 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system including: providing a substrate; mounting an integrated circuit above the substrate; mounting an inner stacking module, having an inner stacking module encapsulation and a molded integral step molded in the inner stacking module encapsulation, above the integrated circuit; and encapsulating the inner stacking module, and the integrated circuit with an encapsulation.

摘要翻译： 一种集成电路封装系统，包括：提供衬底; 在基板上方安装集成电路; 安装内部堆叠模块，在集成电路上方具有模制在内部堆叠模块封装中的内部堆叠模块封装和模制整体步骤; 并且封装内部堆叠模块和集成电路。

公开(公告)号：US09748203B2

公开(公告)日：2017-08-29

申请号：US13327609

申请日：2011-12-15

申请人： DeokKyung Yang ,  In Sang Yoon ,  SeongHun Mun ,  KyungHwan Kim

发明人： DeokKyung Yang ,  In Sang Yoon ,  SeongHun Mun ,  KyungHwan Kim

IPC分类号： H01L23/48 ,  H01L21/76 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06596 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system including: providing a package carrier; mounting an integrated circuit to the package carrier; mounting a circuit interposer above the integrated circuit; mounting a mounting integrated circuit above the circuit interposer; forming a conductive pillar to the circuit interposer adjacent to the mounting integrated circuit; connecting the circuit interposer to the package carrier; and forming an encapsulation on the package carrier.