发明授权
- 专利标题： Process for producing laminated substrate and laminated substrate
- 专利标题（中）： 叠层基板和叠层基板的制造方法
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申请号： US12550340申请日： 2009-08-28
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公开(公告)号： US08765576B2公开(公告)日： 2014-07-01
- 发明人: Shoji Akiyama , Atsuo Ito , Yoshihiro Kubota , Koichi Tanaka , Makoto Kawai , Yuuji Tobisaka
- 申请人： Shoji Akiyama , Atsuo Ito , Yoshihiro Kubota , Koichi Tanaka , Makoto Kawai , Yuuji Tobisaka
- 申请人地址： JP Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/762 ; H01L21/3105
摘要：
A method of manufacturing a laminated substrate is provided. The method includes: forming an oxide film on at least a surface of a first substrate having a hardness of equal to or more than 150 GPa in Young's modulus, and then smoothing the oxide film; implanting hydrogen ions or rare gas ions, or mixed gas ions thereof from a surface of a second substrate to form an ion-implanted layer inside the substrate, laminating the first substrate and the second substrate through at least the oxide film, and then detaching the second substrate in the ion-implanted layer to form a laminated substrate; heat-treating the laminated substrate and diffusing outwardly the oxide film.
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