发明授权
- 专利标题： Package with interposer frame and method of making the same
- 专利标题（中）： 具有插入器框架的封装和制作相同的方法
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申请号： US13448796申请日： 2012-04-17
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公开(公告)号： US08766460B2公开(公告)日： 2014-07-01
- 发明人: Jiun Yi Wu
- 申请人： Jiun Yi Wu
- 申请人地址： TW
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW
- 代理机构： Lowe Hauptman & Ham, LLP
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/52 ; H01L29/40
摘要：
Embodiments of mechanisms of utilizing an interposer frame to form a package using package on package (PoP) technology are provided in this disclosure. The interposer frame is formed by using a substrate with one or more additives to adjust the properties of the substrate. The interposer frame has through substrate holes (TSHs) lined with conductive layer to form through substrate vias (TSVs) with solder balls on adjacent packages. The interposer frame enables the reduction of pitch of TSVs, mismatch of coefficients of thermal expansion (CTEs), shorting, and delamination of solder joints, and improves mechanical strength of the PoP package.
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