Invention Grant
- Patent Title: Full wafer processing by multiple passes through a combinatorial reactor
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Application No.: US13738826Application Date: 2013-01-10
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Publication No.: US08772124B2Publication Date: 2014-07-08
- Inventor: Rajesh Kelekar , Aaron T Francis , Gregory P Lim
- Applicant: Intermolecular Inc.
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/76
- IPC: H01L21/76
Abstract:
Overlapping combinatorial processing can offer more processed regions, better particle performance and simpler process equipment. In overlapping combinatorial processing, one or more regions are processed in series with some degrees of overlapping between regions. In some embodiments, overlapping combinatorial processing can be used in conjunction with non-overlapping combinatorial processing and non-combinatorial processing to develop and investigate materials and processes for device processing and manufacturing.
Public/Granted literature
- US20130171802A1 FULL WAFER PROCESSING BY MULTIPLE PASSES THROUGH A COMBINATORIAL REACTOR Public/Granted day:2013-07-04
Information query
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