公开(公告)号：US09177849B2

公开(公告)日：2015-11-03

申请号：US13719136

申请日：2012-12-18

Applicant: Intermolecular, Inc.

Inventor： Rajesh Kelekar ,  Glen Eric Egami ,  Aaron T. Francis

IPC: H01L21/687 ,  H01L21/683 ,  G03F7/20

CPC classification number: H01L21/6838 ,  G03F7/707 ,  H01L21/68735 ,  H01L21/68757 ,  Y10T279/11

Abstract: Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer's underside. Methods of processing semiconductor wafers employing such chucks are also described.

Abstract translation: 描述了用于在加工期间安装和保持半导体晶片的卡盘，特别适用于涉及将晶片卡盘结构完全浸入液体中的晶片加工。 公开了用于防止或阻碍处理化学品接触和污染正在进行处理的晶片的下侧的大部分的卡盘结构，将这种化学接触限制在晶片周边上容易清洁的相对较小的环形区域。 实施例包括在晶片的下侧上具有补充气体流动的结构，以及产生气体/液体弯月面以防止晶片下侧的化学渗透。 还描述了使用这种卡盘处理半导体晶片的方法。

公开(公告)号：US20140147587A1

公开(公告)日：2014-05-29

申请号：US13685961

申请日：2012-11-27

Applicant: INTERMOLECULAR, INC.

Inventor： Richard R. Endo ,  Rajesh Kelekar

IPC: B05D1/00 ,  B05C11/08

CPC classification number: B05D1/005 ,  B05D1/32

Abstract: A spin deposition apparatus includes a deposition mask configured to be arranged proximate a target substrate. The deposition mask includes at least one fluid reservoir offset from a rotational axis of the deposition mask and configured to hold fluid for dispersal on a portion of a surface of the target substrate.

Abstract translation: 旋转沉积设备包括被配置为邻近目标衬底设置的沉积掩模。 沉积掩模包括从沉积掩模的旋转轴线偏移的至少一个流体储存器，并且构造成保持用于分散在目标基板的表面的一部分上的流体。

公开(公告)号：US08815012B2

公开(公告)日：2014-08-26

申请号：US13738272

申请日：2013-01-10

Applicant: Intermolecular, Inc.

Inventor： Rajesh Kelekar

IPC: H05B6/10 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  H01L21/324

CPC classification number: H01L21/324 ,  H01L21/02002 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/68757 ,  H05B6/105

Abstract: A substrate for processing in a heating system is disclosed. The substrate includes a bottom portion for absorbing heat from a radiating heat source, the bottom portion having a first region having a first emissivity and a second region having a second emissivity less than the first emissivity. The first region and the second region promote thermal uniformity of the substrate by compensating for thermal non-uniformity of the radiating heat source.

Abstract translation: 公开了一种用于加热系统中处理的基板。 衬底包括用于从辐射热源吸收热的底部，底部具有具有第一发射率的第一区域和具有小于第一发射率的第二发射率的第二区域。 第一区域和第二区域通过补偿辐射热源的热非均匀性来促进衬底的热均匀性。

公开(公告)号：US08772124B2

公开(公告)日：2014-07-08

申请号：US13738826

申请日：2013-01-10

Applicant: Intermolecular Inc.

Inventor： Rajesh Kelekar ,  Aaron T Francis ,  Gregory P Lim

IPC: H01L21/76

CPC classification number: H01L21/76 ,  H01L21/02 ,  H01L21/306 ,  H01L21/67017

Abstract: Overlapping combinatorial processing can offer more processed regions, better particle performance and simpler process equipment. In overlapping combinatorial processing, one or more regions are processed in series with some degrees of overlapping between regions. In some embodiments, overlapping combinatorial processing can be used in conjunction with non-overlapping combinatorial processing and non-combinatorial processing to develop and investigate materials and processes for device processing and manufacturing.

公开(公告)号：US20140080322A1

公开(公告)日：2014-03-20

申请号：US13738272

申请日：2013-01-10

Applicant: INTERMOLECULAR, INC.

Inventor： Rajesh Kelekar

IPC: H01L21/324 ,  H01L21/67

CPC classification number: H01L21/324 ,  H01L21/02002 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/68757 ,  H05B6/105

Abstract: A substrate for processing in a heating system is disclosed. The substrate includes a bottom portion for absorbing heat from a radiating heat source, the bottom portion having a first region having a first emissivity and a second region having a second emissivity less than the first emissivity. The first region and the second region promote thermal uniformity of the substrate by compensating for thermal non-uniformity of the radiating heat source.

Abstract translation: 公开了一种用于加热系统中处理的基板。 衬底包括用于从辐射热源吸收热的底部，底部具有具有第一发射率的第一区域和具有小于第一发射率的第二发射率的第二区域。 第一区域和第二区域通过补偿辐射热源的热非均匀性来促进衬底的热均匀性。

公开(公告)号：US20130171802A1

公开(公告)日：2013-07-04

申请号：US13738826

申请日：2013-01-10

Applicant: Intermolecular Inc.

Inventor： Rajesh Kelekar ,  Aaron T. Francis ,  Gregory P. Lim

IPC: H01L21/02

CPC classification number: H01L21/76 ,  H01L21/02 ,  H01L21/306 ,  H01L21/67017

Abstract: Overlapping combinatorial processing can offer more processed regions, better particle performance and simpler process equipment. In overlapping combinatorial processing, one or more regions are processed in series with some degrees of overlapping between regions. In some embodiments, overlapping combinatorial processing can be used in conjunction with non-overlapping combinatorial processing and non-combinatorial processing to develop and investigate materials and processes for device processing and manufacturing.

公开(公告)号：US09038650B2

公开(公告)日：2015-05-26

申请号：US14030968

申请日：2013-09-18

Applicant: Intermolecular, Inc.

Inventor： Rajesh Kelekar

IPC: B67D7/08 ,  H01L21/67 ,  F04B49/06

CPC classification number: B67D7/085 ,  F04B49/065 ,  H01L21/67017 ,  Y10T137/0379 ,  Y10T137/0396 ,  Y10T137/7761 ,  Y10T137/85986 ,  Y10T137/86002

Abstract: In one implementation, a method for providing a fluid at a target pressure may include providing a fluid at a velocity to a supply line through a dispenser, measuring a pressure of the fluid flowing through the supply line, comparing the measured pressure with the target pressure, and adjusting the velocity based on the results of the comparison.

Abstract translation: 在一个实施方案中，用于在目标压力下提供流体的方法可以包括通过分配器以速度向供应管线提供流体，测量流过供应管线的流体的压力，将测量的压力与目标压力进行比较 ，并根据比较结果调整速度。

公开(公告)号：US20150017815A1

公开(公告)日：2015-01-15

申请号：US14505840

申请日：2014-10-03

Applicant: Intermolecular, Inc.

Inventor： Rajesh Kelekar

IPC: H01L21/02

CPC classification number: H01L21/02282 ,  B01J19/0046 ,  B01J2219/0036 ,  B01J2219/00443 ,  B01J2219/00531 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00756 ,  B05B7/00 ,  B05C5/00 ,  C40B50/14 ,  C40B60/14

Abstract: An apparatus and method for combinatorial non-contact wet processing of a liquid material may include a source of a liquid material, a first reaction cell, a second reaction cell, a first plurality of gas jets disposed within an interior of the first reaction cell, the first plurality of gas jets configured to atomize the liquid material transferred to the interior of the first reaction cell, a second plurality of gas jets disposed within an interior of the second reaction cell, the second plurality of gas jets configured to atomize the liquid material transferred to the interior of the second reaction cell, a first vacuum element disposed along a periphery of the first reaction cell, and a second vacuum element disposed along a periphery of the at least a second reaction cell.

Abstract translation: 用于液体材料的组合非接触湿法处理的装置和方法可以包括液体材料的源，第一反应池，第二反应池，设置在第一反应池内部的第一多个气体喷嘴， 所述第一多个气体射流被配置为雾化转移到所述第一反应池的内部的液体材料;第二多个气体射流，其布置在所述第二反应池的内部;所述第二多个气体射流被配置成雾化所述液体材料 转移到第二反应池的内部，沿着第一反应池的周边设置的第一真空元件和沿着至少第二反应池的周边设置的第二真空元件。

公开(公告)号：US20140166050A1

公开(公告)日：2014-06-19

申请号：US13719136

申请日：2012-12-18

Applicant: INTERMOLECULAR, INC.

Inventor： Rajesh Kelekar ,  Glen Eric Egami ,  Aaron T. Francis

IPC: H01L21/683

CPC classification number: H01L21/6838 ,  G03F7/707 ,  H01L21/68735 ,  H01L21/68757 ,  Y10T279/11

Abstract: Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer's underside. Methods of processing semiconductor wafers employing such chucks are also described.

Abstract translation: 描述了用于在加工期间安装和保持半导体晶片的卡盘，特别适用于涉及将晶片卡盘结构完全浸入液体中的晶片加工。 公开了用于防止或阻碍处理化学品接触和污染正在进行处理的晶片的下侧的大部分的卡盘结构，将这种化学接触限制在晶片周边上容易清洁的相对较小的环形区域。 实施例包括在晶片的下侧上具有补充气体流动的结构，以及产生气体/液体弯月面以防止晶片下侧的化学渗透。 还描述了使用这种卡盘处理半导体晶片的方法。

公开(公告)号：US08663746B2

公开(公告)日：2014-03-04

申请号：US13628996

申请日：2012-09-27

Applicant: Intermolecular, Inc.

Inventor： Rajesh Kelekar

IPC: H01L21/66 ,  C25D5/02 ,  C25B15/08 ,  B05B7/06

CPC classification number: C25D21/10 ,  C23C18/1628 ,  C23C18/1669 ,  C25D5/08 ,  C25D17/001 ,  C25D17/008 ,  H01L21/67023

Abstract: An apparatus and system for stirring liquid inside a flow cell. In one implementation, the apparatus includes a rotatable disc configured to receive liquid at a top side of the disc and distribute the liquid substantially evenly around a periphery of the flow cell. The disc has a triangular cross sectional area. The apparatus may further include a set of fins attached to a bottom side of the disc, wherein the set of fins is configured to draw the liquid from the periphery of the flow cell into the center of the flow cell.

Abstract translation: 用于在流动池内搅拌液体的装置和系统。 在一个实施方案中，该装置包括可旋转盘，其构造成在盘的顶侧处接收液体，并将液体基本均匀地分布在流动池的周边周围。 盘具有三角形横截面积。 该装置还可以包括附接到盘的底侧的一组翅片，其中所述翅片组被配置为将液体从流动池的周边抽吸到流动池的中心。