Invention Grant
- Patent Title: Ultrapure colloidal silica for use in chemical mechanical polishing applications
- Patent Title (中): 超纯胶体二氧化硅用于化学机械抛光应用
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Application No.: US13405027Application Date: 2012-02-24
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Publication No.: US08779011B2Publication Date: 2014-07-15
- Inventor: Deepak Mahulikar , Yuhu Wang , Ken A. Delbridge , Gert R. M. Moyaerts , Saeed H. Mohseni , Nichole R. Koontz , Bin Hu , Liqing Wen
- Applicant: Deepak Mahulikar , Yuhu Wang , Ken A. Delbridge , Gert R. M. Moyaerts , Saeed H. Mohseni , Nichole R. Koontz , Bin Hu , Liqing Wen
- Applicant Address: US MI Adrian
- Assignee: Fujifilm Planar Solutions, LLC
- Current Assignee: Fujifilm Planar Solutions, LLC
- Current Assignee Address: US MI Adrian
- Agency: Ohlandt, Greeley, Ruggiero & Perle, LLP
- Main IPC: C01B33/141
- IPC: C01B33/141 ; C01B33/143 ; C09C1/68 ; C09K13/06

Abstract:
A method for producing and using an ultrapure colloidal silica dispersion is disclosed. The ultrapure colloidal silica dispersion has less than 200 ppb of each trace metal impurity disposed therein, excluding potassium and sodium, and less than 2 ppm residual alcohol. The method comprises dissolving a fumed silica in an aqueous solvent comprising an alkali metal hydroxide to produce an alkaline silicate solution, removing the alkali metal via ion exchange to generate a silicic acid solution, adjusting temperature, concentration and pH of said silicic acid solution to values sufficient to initiate nucleation and particle growth, and cooling the silicic acid solution at a rate sufficient to produce the colloidal silica dispersion.
Public/Granted literature
- US20120145950A1 ULTRAPURE COLLOIDAL SILICA FOR USE IN CHEMICAL MECHANICAL POLISHING APPLICATIONS Public/Granted day:2012-06-14
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