A packaging method with backside wafer dicing includes the steps of forming a support structure at the front surface of the wafer then depositing a metal layer on a center area of the backside of the wafer after grinding the wafer backside to reduce the wafer thickness; detecting from the backside of the wafer sections of scribe lines formed in the front surface in the region between the edge of the metal layer and the edge of the wafer and cutting the wafer and the metal layer from the wafer backside along a straight line formed by extending a scribe line section detected from the wafer backside.