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    Multi-chip stack structure and fabrication method thereof
    1.
    发明授权
    Multi-chip stack structure and fabrication method thereof 有权
    多芯片堆叠结构及其制造方法

    公开(公告)号：US07768106B2

    公开(公告)日：2010-08-03

    申请号：US12077003

    申请日：2008-03-13

    Applicant: Jung-Ping Huang ,  Chin-Huang Chang ,  Chien-Ping Huang ,  Chung-Lun Liu ,  Cheng-Hsu Hsiao

    Inventor： Jung-Ping Huang ,  Chin-Huang Chang ,  Chien-Ping Huang ,  Chung-Lun Liu ,  Cheng-Hsu Hsiao

    IPC: H01L23/495 ,  H01L21/00

    CPC classification number: H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48496 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00

    Abstract: A multi-chip stack structure and a fabrication method thereof are proposed, including providing a leadframe having a die base and a plurality of leads and disposing a first and a second chips on the two surfaces of the die base respectively; disposing the leadframe on a heating block having a cavity in a wire bonding process with the second chip received in the cavity of the heating block; performing a first wire bonding process to electrically connect the first chip to the leads through a plurality of first bonding wires, and forming a bump on one side of the leads connected with the first bonding wires; disposing the leadframe in an upside down manner to the heating block via the bump with the first chip and the first bonding wires received in the cavity of the heating block; and performing a second wire bonding process to electrically connect the second chip to the leads through a plurality of second bonding wires. The bump is used for supporting the leads to a certain height so as to keep the bonding wires from contacting the heating block and eliminate the need of using a second heating block in the second wire bonding process of the prior art, thereby saving time and costs in a fabrication process. Also, as positions where the first and second bonding wires are bonded to the leads on opposite sides of the leadframe correspond with each other, the conventional problems of adversely affected electrical performance and electrical mismatch can be prevented.

    Abstract translation: 提出了一种多芯片堆叠结构及其制造方法，包括提供具有芯片基底和多个引线的引线框架，并分别在模具基座的两个表面上设置第一和第二芯片; 将引线框架布置在具有引线接合工艺中的空腔的加热块上，第二芯片容纳在加热块的空腔中; 执行第一引线接合工艺，以通过多个第一接合线将第一芯片电连接到引线，以及在与第一接合线连接的引线的一侧上形成凸块; 通过第一芯片和第一接合线容纳在加热块的空腔中，通过凸块将引线框倒置放置到加热块， 以及执行第二引线接合处理，以通过多个第二接合线将所述第二芯片电连接到所述引线。 凸块用于将引线支撑到一定高度，以便使接合线不会接触加热块，并且在现有技术的第二引线接合过程中不需要使用第二加热块，从而节省了时间和成本 在制造过程中。 此外，由于第一和第二接合线与引线框架的相对侧上的引线接合的位置彼此对应，可以防止电性能和电不匹配受到不利影响的常规问题。

    VERTICAL FLOW METER EQUIPPED
    8.
    发明申请
    VERTICAL FLOW METER EQUIPPED 审中-公开
    立式流量计

    公开(公告)号：US20150276440A1

    公开(公告)日：2015-10-01

    申请号：US14242056

    申请日：2014-04-01

    Applicant: Ya-Ping Huang

    Inventor： Ya-Ping Huang

    IPC: G01F1/05

    CPC classification number: G01F1/24

    Abstract: A vertical flow meter comprises a vertical barrel, an adjustment mechanism and an induction mechanism. The vertical barrel has a flow passage inside to house a vertical rod and a magnetic element coupling on the vertical rod. The adjustment mechanism straddles a holding plate and a scale plate that are located at two sides of the vertical barrel, and includes an adjustment portion at one side thereof, at least one adjustment member corresponding to a second elongate slot of the scale plate and fastening to the adjustment portion, a protrusive connection portion at another side opposite to the adjustment portion, and a connection plank connecting with the adjustment portion and protrusive connection portion. The induction mechanism is disposed at one side of the protrusive connection portion. Through magnetic attraction between the induction mechanism and the magnetic element, the adjustment mechanism can be moved upward or downward on the scale plate.

    Abstract translation: 垂直流量计包括垂直桶，调节机构和感应机构。 垂直桶具有内部的流动通道以容纳垂直杆和在垂直杆上的磁性元件联接。 调节机构跨越位于垂直筒体的两侧的保持板和刻度板，并且在其一侧包括调节部分，至少一个对应于刻度板的第二细长槽的调节构件，并且紧固到 调节部分，与调节部分相对的另一侧的突出连接部分，以及与调节部分和突出连接部分连接的连接板。 感应机构设置在突出连接部的一侧。 通过感应机构和磁性元件之间的磁吸引，调节机构可以在刻度板上向上或向下移动。

    Rotatable and extendable mop
    9.
    发明授权
    Rotatable and extendable mop 有权
    可旋转和可延伸的拖把

    公开(公告)号：US09085078B1

    公开(公告)日：2015-07-21

    申请号：US14672702

    申请日：2015-03-30

    Applicant: Yi-Ping Huang

    Inventor： Yi-Ping Huang

    IPC: A47L13/142 ,  A47L13/58 ,  B25G1/04 ,  A47L13/20

    CPC classification number: B25G1/04 ,  A47L13/14 ,  A47L13/142 ,  A47L13/58

    Abstract: A rotatable and extendable mop includes a first rod body, a second rod body and a mop head. An end of the second rod body is sheathed with the first rod body, extending and moving relatively with respect to the first rod body. An end of the mop head is connected to the other end of the second rod body including a first connector, a second connector, a retainer, a gasket, a spring and a link rod. The first connector is sheathed with the second connector, and includes a first clip part corresponding to a first helical track, allowing the first clip part to traverse in the first helical track. An end of the link rod is connected to the second connector, and the retainer, gasket and spring are sheathed orderly with the link rod relative to the second connector. The retainer is fastened to the first connector.

    Abstract translation: 可旋转和可延伸的拖把包括第一杆体，第二杆体和拖把头。 第二杆体的端部与第一杆体一起被包覆，相对于第一杆体相对延伸和移动。 拖把头的端部连接到第二杆体的另一端，包括第一连接器，第二连接器，保持器，垫圈，弹簧和连杆。 第一连接器用第二连接器包覆，并且包括对应于第一螺旋轨道的第一夹持部分，允许第一夹持部分在第一螺旋形轨道中穿过。 连杆的端部连接到第二连接器，并且保持器，垫圈和弹簧相对于第二连接器与连杆相连接。 保持器固定在第一连接器上。

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