Invention Grant
- Patent Title: Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof
- Patent Title (中): 发光二极管及其制造方法，发光二极管模块及其制造方法
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Application No.: US13428726Application Date: 2012-03-23
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Publication No.: US08785953B2Publication Date: 2014-07-22
- Inventor: Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
- Applicant: Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
- Applicant Address: KR Suwon-Si, Seoul
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0027021 20110325; KR10-2011-0027033 20110325; KR10-2011-0104223 20111012
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
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