公开(公告)号：US20120241797A1

公开(公告)日：2012-09-27

申请号：US13428726

申请日：2012-03-23

申请人： Hak Hwan KIM ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

发明人： Hak Hwan KIM ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

IPC分类号： H01L33/50

CPC分类号： H01L33/62 ,  H01L21/568 ,  H01L33/505 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/83

摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

摘要翻译： 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

公开(公告)号：US08785953B2

公开(公告)日：2014-07-22

申请号：US13428726

申请日：2012-03-23

申请人： Hak Hwan Kim ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

发明人： Hak Hwan Kim ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L21/568 ,  H01L33/505 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/83

摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

摘要翻译： 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

公开(公告)号：US08927305B2

公开(公告)日：2015-01-06

申请号：US13562019

申请日：2012-07-30

申请人： Jong Sup Song ,  Jae Sung You ,  Tae Gyu Kim

发明人： Jong Sup Song ,  Jae Sung You ,  Tae Gyu Kim

IPC分类号： H01L21/00 ,  H01L33/52 ,  H01L33/50

CPC分类号： H01L33/52 ,  H01L33/505 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091

摘要： There is provided a method of manufacturing a light emitting device, the method including: mounting a plurality of light emitting devices on an adhesive layer; arranging upper surfaces of the plurality of light emitting devices to be disposed horizontally using a pressing member; forming a wavelength conversion part covering the plurality of light emitting devices on the adhesive layer by applying a resin including at least one phosphor material; planarizing an upper surface of the wavelength conversion part using the pressing member; and separating the adhesive layer from the plurality of light emitting devices.

摘要翻译： 提供一种制造发光器件的方法，该方法包括：将多个发光器件安装在粘合剂层上; 使用按压构件将多个发光装置的上表面布置成水平布置; 通过施加包括至少一种荧光体材料的树脂来形成覆盖所述粘合剂层上的所述多个发光器件的波长转换部分; 使用所述按压部件对所述波长转换部的上表面进行平面化; 以及从所述多个发光器件分离所述粘合剂层。

公开(公告)号：US08960932B2

公开(公告)日：2015-02-24

申请号：US13436102

申请日：2012-03-30

申请人： Jae Sung You ,  Jong Sup Song

发明人： Jae Sung You ,  Jong Sup Song

IPC分类号： F21V9/16 ,  H01L33/50 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58

CPC分类号： H01L25/0753 ,  G02B19/0014 ,  G02B19/0066 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device includes: a substrate having a bar shape; a plurality of light emitting elements separately mounted in a lengthwise direction of the substrate on an upper surface of the substrate; and a light-transmissive cover formed to be upwardly convex, having one or more localized concave portions, and installed on the substrate to cover at least two of the plurality of light emitting elements together.

摘要翻译： 发光器件包括：具有条形的衬底; 多个发光元件，分别安装在基板的上表面上的基板的长度方向上; 以及形成为向上凸起的具有一个或多个局部凹部的透光性盖，并且安装在所述基板上以将所述多个发光元件中的至少两个覆盖在一起。

公开(公告)号：US08896018B2

公开(公告)日：2014-11-25

申请号：US13483768

申请日：2012-05-30

申请人： Jong Sup Song ,  Tae Gyu Kim ,  Jae Sung You

发明人： Jong Sup Song ,  Tae Gyu Kim ,  Jae Sung You

IPC分类号： H01L33/00 ,  B25B11/00 ,  H01L33/50

CPC分类号： H01L33/505 ,  B25B11/005 ,  H01L2933/0041

摘要： There is provided a vacuum tray including a pocket part; a seating part being stepped downwardly from a bottom surface of the pocket part and having a light emitting device seated therein; and a cavity part being stepped downwardly from edges of the seating part and having an electrode terminal of the light emitting device accommodated therein. The pocket part may include a plurality of pocket parts having a matrix structure, such that the plurality of pocket parts are arranged in columns and rows.

摘要翻译： 提供包括袋部的真空托盘; 从所述口袋部的底面向下方突出并具有安置在其中的发光装置的座部; 以及空腔部分，其从所述就座部分的边缘向下阶梯并且容纳有所述发光装置的电极端子。 口袋部分可以包括具有矩阵结构的多个口袋部件，使得多个袋部件以列和列排列。

公开(公告)号：US20130029439A1

公开(公告)日：2013-01-31

申请号：US13562019

申请日：2012-07-30

申请人： Jong Sup Song ,  Jae Sung You ,  Tae Gyu Kim

发明人： Jong Sup Song ,  Jae Sung You ,  Tae Gyu Kim

IPC分类号： H01L33/50

CPC分类号： H01L33/52 ,  H01L33/505 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091

摘要： There is provided a method of manufacturing a light emitting device, the method including: mounting a plurality of light emitting devices on an adhesive layer; arranging upper surfaces of the plurality of light emitting devices to be disposed horizontally using a pressing member; forming a wavelength conversion part covering the plurality of light emitting devices on the adhesive layer by applying a resin including at least one phosphor material; planarizing an upper surface of the wavelength conversion part using the pressing member; and separating the adhesive layer from the plurality of light emitting devices.

摘要翻译： 提供一种制造发光器件的方法，该方法包括：将多个发光器件安装在粘合剂层上; 使用按压构件将多个发光装置的上表面布置成水平布置; 通过施加包括至少一种荧光体材料的树脂来形成覆盖所述粘合剂层上的所述多个发光器件的波长转换部分; 使用所述按压部件对所述波长转换部的上表面进行平面化; 以及从所述多个发光器件分离所述粘合剂层。

公开(公告)号：US20130032842A1

公开(公告)日：2013-02-07

申请号：US13563227

申请日：2012-07-31

申请人： Jong Kil PARK ,  Sung Uk Zhang ,  Jong Sup Song

发明人： Jong Kil PARK ,  Sung Uk Zhang ,  Jong Sup Song

IPC分类号： H01L33/60 ,  H01L33/48

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L25/075 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00

摘要： There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a body part including a through hole formed in a thickness direction; at least one light emitting device disposed within the through hole; and a wavelength conversion part filling the through hole and supporting the light emitting device.

摘要翻译： 提供了一种发光器件封装及其制造方法。 发光器件封装包括：主体部，包括沿厚度方向形成的通孔; 设置在通孔内的至少一个发光器件; 以及波长转换部分，其填充所述通孔并支撑所述发光器件。